A leakage prevention system including a cold plate is proposed in the current application. In one embodiment, a cold plate comprises an inlet port to receive cooling fluid from an external cooling source; an outlet port to return the cooling fluid back to the external cooling source; a sealing notch integrated with a sealing pad included in an outside layer of the cold plate; a nanoparticle channel disposed inside the outside layer; the nanoparticle channel is filled with a plurality of nanoparticles; a cooling area disposed inside the nanoparticle channel; the cooling area is to receive the cooling fluid from the inlet port, to exchange heat generated by an electronic device attached to the cold plate and carried by the fluid, and to return the cooling fluid via the outlet port; the plurality of nanoparticles in cooling fluid is used to detect a leakage of the cooling fluid.

It is an object to reduce a difference in temperature of a refrigerant between an upstream side and a downstream side of a flow path even in a case where all semiconductor elements generate heat due to inverter operation and the like. A semiconductor device includes at least one semiconductor element, a base plate, a plurality of cooling fins, a jacket, and a partition. The partition is disposed below the plurality of cooling fins in the jacket. The partition has at least one inflow opening to allow the refrigerant having flowed in through the refrigerant inlet to flow through the plurality of cooling fins, and has a portion abutting the jacket on the side of the refrigerant inlet. The at least one inflow opening is located to correspond to the at least one semiconductor element.

An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.

A cold plate assembly for a battery module comprising a plurality of battery cells, comprising: a first cold plate comprising a plurality of openings; a second cold plate comprising a plurality of openings and being arranged below the first cold plate such that the openings of the second cold plate are aligned at least in part with the openings of the first cold plate, wherein the second cold plate and the first cold plate are joined together and a plurality of channels for accommodating a cooling fluid are formed between the first cold plate and the second cold plate; and an interconnection layer comprising a plurality of interconnections for electrically connecting the plurality of battery cells and arranged below the second cold plate such that each interconnection is accessible at least in part via an opening of the first cold plate and the corresponding opening of the second cold plate.

Configurations for cooling systems are disclosed. In at least one embodiment, one or more distribution manifolds are formed within at least one panel of a server unit housing to receive a liquid and direct the liquid to one or more outlets, the one or more outlets to couple to one or more cold plates.

An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.

A server (10), a server rack (50) and a data centre (100, 150) are provided. The server (10) includes a housing (12) defining a gaseous flow passage. A plurality of active components (14) and a plurality of passive components (16) are provided in the housing (12). A plurality of liquid cooling devices (18) is attached to respective ones of the active components (14).

A cooling device includes a cooling assembly which includes a cold plate extending in a first direction, a pump and a tank on one side of the cold plate in a second direction perpendicular to the first direction, and a partition extending in the first direction and covering the cold plate on one side in the second direction. The cold plate and the partition define a first refrigerant flow path through which a refrigerant flows. The pump includes a pump chamber in which an impeller is housed, the impeller moving the refrigerant. The tank includes a tank chamber in which the refrigerant flows. The pump chamber and the tank chamber communicate with each other through a first tank hole portion. The partition includes a first hole portion through which the first refrigerant flow path and the tank chamber communicate. The first tank hole portion is provided on one side in the first direction with respect to the first hole portion.

A cyclone cooler device includes a housing that defines an interior channel elongated along a center axis. One or more of the fluid passage or configuration of an inlet end of the channel is shaped to induce a swirling flow of a cooling fluid within the channel while the channel is thermally coupled with one or more heat sources. The swirling flow of the cooling fluid removes thermal energy from and cools the one or more heat sources. During the swirling flow, the cooling fluid rotates around the center axis of the channel while also moving along the length of the center axis. The cooling fluid changes phases during the swirling flow to cool the heat source(s).

A cold plate includes an outer housing, and a fluid circuit within the outer housing. The fluid circuit includes a fluid inlet located on a first sidewall of the outer housing, a fluid outlet located on the first sidewall of the outer housing, and a primary channel disposed between and fluidly connecting the fluid inlet and the fluid outlet. The primary channel includes an inlet leg downstream of the fluid inlet, an outlet leg upstream of the fluid outlet, and a connecting portion fluidly connecting the inlet leg and the outlet leg. The fluid circuit further includes a first secondary channel branching from the inlet leg of the primary channel, and a second secondary channel branching from the outlet leg of the primary channel.