A method for controlling a cooling system of a rack, the rack comprising a heat generating component. The method comprises receiving, by a controller, at least one first temperature indications indicative of temperature variations of at least one heat transfer fluid circulating in at least one respective liquid channel of the cooling system; receiving, by the controller, at least one second temperature indications indicative of a temperature of an air flow of ambient air within the rack, the air flow being generated by at least one fan of the cooling system; and adjusting, based on the at least one first and second temperature indications, a rotational speed of the at least one fan and a rotational speed of at least one pump configured for causing the at least one heat transfer fluid to flow in at least one respective liquid channel.

A module modular containment system for isolating and cooling racks of information handling systems in a facility comprises a plurality of vertical panels coupled to a top panel to isolate the rack from room air and a heat exchanger coupled to a facility water feed that supplies water at a water temperature greater than the room air temperature. Heated air exiting the rack passes through the heat exchanger to transfer heat to the water such that the air is cooled to the first air temperature. An air conditioning system and the modular containment system can operate independently to cool the room air to a lower air temperature for the comfort of people in the facility and to cool information handling systems based on operating parameters of the information handling systems.

A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1×CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

The electric control box includes a box body, a mounting board, an electronic component, and a heat sink, the box body being provided with a mounting cavity; the mounting plate is disposed in the mounting cavity and the mounting cavity forms a first cavity and a second cavity located on the two sides of the mounting board; the electronic component is arranged in the second cavity; the heat sink comprises a heat exchange body and a header assembly; the header assembly is used for providing refrigerant flow to the heat exchange body; at least part of the heat exchange body is arranged in the first cavity, and is heat-conductively connected to the electronic component; the mounting board is used for blocking the condensed water on the heat sink from flowing into the second cavity.

A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

Embodiments are disclosed of a fluid distribution apparatus. The fluid distribution apparatus includes a hot manifold including a hot chamber fluidly coupled to one or more fluid return inlets and a main fluid return outlet, and a cold manifold including a cold chamber fluidly coupled to a main fluid supply inlet and one or more fluid supply outlets. A thermoelectric device is sandwiched between the hot manifold and the cold manifold so that the thermoelectric device is in thermal contact with the hot chamber and in thermal contact with the cold chamber. The apparatus is connected to either a server energy storage unit or a rack mounted energy unit through dedicated busbar.

A cooling device includes at least two cooling units, each cooling unit including a plate-shaped cold plate extending in a horizontal direction, a radiator extending in a first direction perpendicular to the horizontal direction and having a plurality of plate-shaped fins which, on the cold plate, is disposed parallel to a second direction perpendicular to the first direction, and a pump which supplies a refrigerant liquid to the cold plate and the radiator, in which the pump is adjacent to the radiator and is disposed in the second direction of the radiator, and the pump of one first cooling unit of the two cooling units faces the other second cooling unit of the two cooling units in the second direction or in a third direction orthogonal to the first direction and the second direction.

The instant application pertains to new liquid level monitoring apparatus and a cooling system for computer components that employs the liquid level monitoring apparatus. In one embodiment, the liquid level measurement device comprises a load cell and a buoyancy element. The buoyancy element is configured to be partially submerged in a dielectric liquid. The load cell and the buoyancy element are operably connected such that a change in liquid volume may be determined using Archimedes' principle.

A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, at least a second conduit, stand, and at least a propulsion-like apparatus. The at least a first and second conduits have first and second modifiable portions comprising first and second openings. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel generating at least a first flow channel for directing a first flow of the dielectric thermally conductive fluid. The at least a propulsion-like apparatus moves the dielectric thermally conductive fluid from one face to an opposite face in the same direction as the first flow, supplementing and enhancing circulation within the fluid-tight containment vessel.