A cooling system including a support structure and a cooling element is described. The cooling element has a thickness and includes an anchored region and a cantilevered arm. The anchored region is coupled to and supported by the support structure. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes at least one cavity therein. The at least one cavity has a depth of at least one-third and not more than three-fourths of the thickness of the cooling element. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid for cooling a heat-generating structure.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Fluid replacement structures used in immersion cooling tanks can include various enhancements to make them functional beyond simply taking up space. For example, the density of fluid replacement structures can be variable to assist with buoyancy control. As another example, fluid replacement structures can be designed to enable vaporized working fluid to be directed to a desired location. As another example, fluid replacement structures can include emergency cooling features, such as different substances that cause an endothermic reaction to occur when they are mixed together. The substances can be separated by a membrane that melts when the temperature reaches a certain point. As another example, a fluid replacement structure can provide structural support for an immersion cooling tank when negative pressure operations are performed. Fluid replacement structures can also include alignment features, lifting features, locking features, mating guides, fiducial markers, or the like.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a plurality of in-rack coolant distribution units (IRCDUs) include a first IRCDU and a second IRCDU that are interchangeable within a rack depending on a type of coolant to be provided to a rack from a coolant distribution unit (CDU), so that a first IRCDU that is calibrated to a first coolant can distribute a first coolant and a second IRCDU that is calibrated to a second coolant can distribute a second coolant to a rack manifold of a rack.

A plasma deposition system comprising a wafer platform, a second electrode, a first electrode, a first high voltage pulser, and a second high voltage pulser. In some embodiments, the second electrode may be disposed proximate with the wafer platform. In some embodiments, the second electrode can include a disc shape with a central aperture; a central axis, an aperture diameter, and an outer diameter. In some embodiments, the first electrode may be disposed proximate with the wafer platform and within the central aperture of the second electrode. In some embodiments, the first electrode can include a disc shape, a central axis, and an outer diameter. In some embodiments, the first high voltage pulser can be electrically coupled with the first electrode. In some embodiments, the second high voltage pulser can be electrically coupled with the second electrode.

In one embodiment, an immersion cooling system includes a container to contain first coolant received from a first cooling source and server chassis at least partially submerged into the first coolant. Each server chassis includes an electronic device and a cooling plate attached thereon to extract at least a portion of heat generated by the electronic device. The cooling plate includes an inlet port to receive second coolant from a second cooling source, a coolant channel to distribute the second coolant, and an outlet port to return the second coolant back to the second cooling source. The cooling system further includes a return manifold to be coupled to the second cooling source, the return manifold having one or more manifold return connectors respectively coupled with the server chassis and to receive and return the second coolant from the server chassis back to the second cooling source.

An inverter device intended to convert a DC voltage into three phases of a polyphase AC voltage with a predetermined frequency, the inverter device comprising three single-phase inverters, each of the three single-phase inverters being able to deliver one of the three phases.

An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

A connector assembly includes a first and a second component. Each of the components including a connector body, a valve, a handle, a handle lock, and a connector lock. The handles open and close respective valves. Each of the handles has locked and unlocked positions. The handle locks prevent or inhibit the respective handles from being moved between open and closed positions. The handle locks in unlocked positions enable the respective handles to be moved between open and closed positions. The first and second components are configured to be releasably assembled with each other. The connector locks in their respective closed positions assist in preventing or inhibiting the disassembling of the first and second components.

The present disclosure provides a garment comprising: a disinfecting device comprising: a cavity, a sensor operative to actuate upon one or more objects entering the cavity, and a disinfecting portion configured to disinfect the one or more objects within the cavity, the disinfecting portion being actuated upon receiving an indication from the sensor of the one or more objects entering the cavity; and a lighting apparatus disposed on an outer surface of the garment in operative communication with the disinfecting device, the lighting apparatus comprising: a clean visual indicator, an unclean visual indicator, and a switch configured to: responsive to a predetermined amount of time passing and the disinfecting portion not being actuated, display the unclean visual indicator and stop display of the clean visual indicator, and responsive to the disinfecting portion being activated, display the clean visual indicator and stop display of the unclean visual indicator.