A two-phase immersion cooling system may include an immersion tank configured to receive a dielectric fluid. The immersion tank may have an interior volume including a lower portion and an upper portion. The immersion tank may have an electronic device region configured to receive one or more electronic devices. The system may include a condenser mounted in the upper portion of the immersion tank. The system may include a liquid deflector located in the upper portion of the immersion tank and at least partially between a top side of the electronic device region and a top side of the condenser. The liquid deflector may be configured to prevent or inhibit dielectric liquid from splashing from the electronic device region onto the condenser. Other examples may be claimed or described.

A cooling apparatus for a medium voltage switchgear includes an evaporator section; a fluid conduit; and a condenser section. The evaporator section surrounds a current carrying contact and is configured such that fluid within the evaporator section can contact an outer surface of the current carrying contact. The evaporator section is fluidly connected to the fluid conduit. At least part of the evaporator section is electrically insulating and is connected to the fluid conduit. The fluid conduit is fluidly connected to the condenser section. In use, a working fluid in the evaporator section is heated to a vapor state, the vapor is transferred by the fluid conduit to the condenser section, and the vapor in the condenser section is condensed to the working fluid. The working fluid is passively returned to the evaporator section.

Thermal regulation device intended for at least one electrical component whose temperature must be regulated, the thermal regulation device including at last a housing, a cover affixed to said housing and a first circuit, configured to allow circulation of a dielectric fluid. The housing includes at least a plurality of lateral walls delimiting an internal volume of the housing in which at least the electrical component extends. The first circuit includes at least one dielectric fluid supply duct formed between the housing and the lid, at least one of the lateral walls and/or the bottom wall having at least one orifice for spraying the dielectric fluid into the internal volume, which is fluidically connected at least to the supply duct.

The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed and then flow downward along wave-pattern flow paths having zigzag shapes, thereby providing an advantage of improving heat dissipation performance without increasing a size thereof.

Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

An adapter plate and a fastening system for fastening a manifold to a rack in a datacenter is disclosed. The adapter plate is associated with the manifold and has holes to receive buttons in configurable positions. The configurable positions enable the buttons to mate with keyholes of a bracket of the rack in order to fasten the manifold to the bracket.

According to one embodiment, an immersion cooling system may include a container to receive one or more server blades, each having electronics, at least partially submerged within a two-phase coolant contained within the container. The immersion cooling system may also include a cover panel to cover the phase change area. This area may include a liquid region defined to contain the two-phase coolant therein, and a vapor region defined between the cover panel and a surface of the two-phase coolant. The cover panel includes a plurality of slots, covered with rotatable panels. At least one of the slots is configured to allow a server blade to be inserted into the liquid region and at least partially submerged into the two-phase coolant. The slots may be configured to allow a condensing unit to be inserted into the vapor region.

Embodiments are disclosed of an information technology (IT) cooling system. The system includes an IT container having an internal volume. Inside the internal volume there is an immersion fluid region adapted to submerge one or more servers in a two-phase immersion fluid. An immersion condenser is positioned above the immersion fluid region in the internal volume. The design includes a circulation condenser. The circulation condenser is fluidly coupled to a liquid distribution manifold and a vapor return manifold that are positioned in the internal volume above the immersion tank (i.e., the immersion fluid region) and are adapted to circulate a two-phase circulation fluid. The circulation condenser is also fluidly coupled to the immersion condenser, and an external cooling fluid is pumped from the circulation condenser to the immersion condenser. The distribution manifolds are adapted to be fluidly coupled to the server liquid cooling loops.