An immersion cooling system and methods for operating the system are described. The system can comprise a vessel configured to hold thermally conductive, condensable dielectric fluid; a pressure controller to reduce or increase an interior pressure of the vessel; a computer component configured to be at least partially submerged within the dielectric fluid; and a fluid circulation system configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter and deliver the dielectric fluid to a bath area of the vessel.

A method and system for controlling operation of an immersion cooling system having an immersion cooling tank adapted to contain a heat transfer fluid used to immersion cool a heat-generating object contained therein, the method including: sampling a volume of the heat transfer fluid while the object remains in an operating state; measuring at least one property or parameter of the sampled heat transfer fluid; generating and transmitting measurement data to a control unit; comparing measurement data with respective threshold data using the control unit; and controlling operation of the immersion cooling system with the control unit based on the comparison.

The invention is a power electronic system comprising at least one power electronic component implemented at least partly on at least one circuit board. The circuit boards are planar and circular or toroidal in shape with the center thereof comprising a circular opening having a diameter D cooperating with a hose for circulating a flow.

A gas storage device includes a casing, a lift platform, a lift mechanism, a driving mechanism, an exhaust valve and a gas joint. The lift platform is movably disposed in the casing, wherein a gas storage space is between a bottom of the casing and the lift platform. The lift mechanism is disposed in the casing and connected to the lift platform. The driving mechanism is connected to the lift mechanism. The driving mechanism drives the lift mechanism to drive the lift platform to move. The exhaust valve is connected to the lift platform and communicates with the gas storage space. The gas joint is connected to the bottom of the casing and communicates with the gas storage space.

An electronic rack includes a condensing unit to be coupled to a first distribution manifold to circulate single-phase cooling fluid received from a first cooling fluid source. The electronic rack further includes a server chassis unit positioned underneath the condensing unit, and the server chassis unit is coupled to a second distribution manifold to receive two-phase cooling fluid from a second cooling fluid source. The second distribution manifold fills the server chassis which contains one or more electronic devices to at least partially submerged the electronics devices in the two-phase cooling fluid, wherein the two-phase cooling fluid is to extract heat from the electronic devices and to evaporate into vapor upwardly into the condensing unit, and wherein the condensing unit is to condense the vapor into a fluid phase and to return the fluid downwardly back into the server chassis unit.

Provided is a heat dissipating apparatus for electronic elements which has the minimum size but has improved heat dissipating performance. To this end, the heat dissipating apparatus for electronic elements, according to the present invention, comprises: a heat dissipating housing having an internal space; a shield case formed of a thermally conductive material, wherein the shield case is disposed in the heat dissipating housing and partitions the internal space into a first chamber which is a vacuum space to be filled with a refrigerant and a second chamber which is a non-vacuum space; and a printed circuit board which is disposed in the shield case and has a heat dissipating element. The shield case evaporates the refrigerant by using sensible heat transferred from the heat dissipating element to the shield case and latent heat transferred from the shield case to the first chamber.

A multi-channel cold plate for cooling chip wherein a first set of cooling channels function as main cooling channels and a second set of cooling channels function as a secondary and/or backup cooling channels. The two sets of cooling channels are fluidly isolated from each other, such that cooling fluid from one sent of channels cannot flow or intermix with the cooling fluid of the other cooling channel. The secondary cooling channels can be operated when demand for heat removal is increased or when the main cooling channels is unable to manage the thermal condition of the chip properly.

A heat dissipation device and a robot using the same are provided. The heat dissipation device comprises a porous material layer, a transporting tube and a liquid. The at least one porous material layer is disposed on a housing surface of a robot. The porous material layer has an evaporation surface and an accommodation space. The evaporation surface is disposed through and exposed from the housing surface. The evaporation surface and the accommodation space are in fluid communication with each other. The transporting tube is connected to the at least one porous material layer and in fluid communication with the accommodation space. The liquid is transported into the at least one accommodation space through the transporting tube and exposed from the evaporation surface. Thus, the liquid evaporates at the evaporation surface to reduce a temperature of the housing surface of the robot via convection and evaporation.

A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with phase change liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the two phase liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. An air mover generates pressure differential within the containment passageway to direct the vapor towards the condenser.

A cooling device comprising a cooling circuit comprising a compressor, which is adapted to compress cooling agent in the cooling circuit during an active cooling mode, wherein the compressed cooling agent contains lubricant oil from the compressor; a condensing unit, which is connected to the compressor by a first fluid line of the cooling circuit; an evaporator, which comprises a top part, a bottom part, and a plurality of evaporating tubes connecting the top part with the bottom part, wherein the top part is connected to the condensing unit by a second fluid line of the cooling circuit, and wherein the bottom part is connected to the compressor by a third fluid line of the cooling circuit.