A data center and a data center cluster have plurality of immersion cooling systems and a plurality of coolant units that provide two-phase coolant to one or more of the plurality of immersion cooling systems. Each coolant unit dispatches and manages two-phase coolant to two or more of the plurality of immersion cooling systems. The coolant units can fill or empty an immersion tank of an immersion cooling system, and can empty or fill a coolant tank in the coolant unit. A single-phase cooling fluid cools the vapor phase of the two-phase coolant in each immersion cooling system. The coolant units are modular, with a common interface to other coolant units and to immersion cooling systems to create a scalable cooling system and data center.

A coolant management unit for providing liquid cooling for backup battery unit (BBU) modules of an electronic rack includes a BBU return manifold, a BBU supply manifold, a balance loop, and a power bus. For example, a BBU supply manifold having a rack supply connector to receive cooling fluid from a rack supply manifold and a BBU supply connector to be connected to one of the BBU modules to distribute the cooling fluid. A BBU return manifold to be coupled to a rack return manifold, wherein the BBU return manifold is to receive vapor from the BBU modules. A balance loop connected to each of the BBU modules to establish a fluid connection amongst the BBU modules, such that a level of the cooling fluid in each of the BBU modules remains similar.

An electronic device (10) with a liquid cooling mechanism includes an electronic device body (1), a heat dissipation module (2) and a liquid cooling module (3). The electronic device body (1) includes a housing (11) and at least one heat generating element (12) installed in the housing (11). The heat dissipation module (2) is contained in the housing (11) and attached to the heat generating element (12). The liquid cooling module (3) includes a liquid cooling pipe (31) contained in the housing (11) and attached to the heat dissipation module (2), and two ends of the liquid cooling pipe (31) have two interface portions (311) exposed from the housing (11). In this way, the liquid cooling pipe (31) is used for water cooling to achieve a desirable cooling efficiency for the electronic device (10).

The disclosure provides a system, for designing and developing immersion cooling in data centers. The system includes multiple aisles that perform different functions. One of the aisles includes space for housing immersion tanks in which components of the data center may be positioned to be cooled. A second aisle allows the immersion tanks to be placed in the other aisle and for backside access. A third aisle transfers vapor from the aisle housing the immersion tanks to a vapor return unit to condense the vapor. A distribution unit distributes the coolant to cool the components of the data center is designed at the second aisle. The aisles and other units can be modularized to allow for deployment to meet different types of data center requirements.

A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

According to one embodiment, a cooling assembly includes a cooling plate to be attached to an electronic device and a bidirectional connector for circulating cooling fluid to the cooling plate. The bidirectional connector includes a first tubing structure having a first fluid channel therein to supply the cooling fluid flowing in a first direction to the cooling plate, a second tubing structure that encloses the first tubing structure therein. The first tubing structure is positioned spaced apart from the second tubing structure to form a second fluid channel between an outer surface of the first tubing structure and an inner surface of the second tubing structure. The second fluid channel is configured to receive the cooling fluid returned from the cooling plate. The first and second fluid channels are configured to operate a supply and a return fluid streams in opposite directions, respectively.

A fluid deployment unit includes an expandable container containing mixed fluids in a gaseous region and a liquid region, where the expandable container includes a gas-out port, a liquid-out port, a gas-in port, and a liquid-in port. The fluid deployment unit includes a first three-way valve having a first port coupled to the liquid-out port, a second port coupled to the gas-out port, and a third port matable to an inlet of an electronic rack. The fluid deployment unit includes a second three-way valve having a first port matable to an input port of a liquid-to-liquid exchange unit of a testing assistant unit, a second port coupled to the gas-in port, and a third port matable to an outlet of the electronic rack, where the liquid-in port of the expandable container is matable to an output port of the liquid-to-liquid exchange unit.

Embodiments include apparatuses, systems and methods for a computer device with a casing and a substance in the casing substantially surrounding a computer component in the casing. In embodiments, the computer device may be a command and control computer, such as for example, an autonomous or semi-autonomous vehicle. In embodiments, the substance may be an electrically isolative and shear-thickening fluid to provide thermo-mechanical protection to a computer component. In the described embodiments, the substance may dampen mechanical shock or vibrational impact on the processor and the memory. The shear-thickening gel may further be thermally conductive in embodiments. In the embodiments, the casing may be substantially filled with the substance and the substance is to conduct heat away from the processor and the memory toward an outer edge of the casing. Other embodiments may also be described and claimed.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more flow controllers is associated with a cold plate and with a thermosyphon condenser that is elevated with respect to a cold plate so that two-phase fluid is enabled for gravity-assisted downflow in a liquid phase to a cold plate for absorption of heat and is enabled for buoyancy-driven upflow through a riser tube into a thermosyphon condenser for dissipation of heat of at least one computing device.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a control unit within a rack has a pump or compressor unit to cause two-phase fluid to circulate through a cold plate associated with a computing device and to circulate through a heat exchanger associated with a rear door of a rack, so as to dissipate heat from a computing device through a heat exchanger by a control unit within a rack.