Embodiments of this application provide a method and apparatus for controlling a two-phase cold plate liquid cooling system, and a system. The method includes: controlling a gas extraction tube to extract a gaseous medium from an outlet of an evaporator in an operation process of the two-phase cold plate liquid cooling system, where the two-phase cold plate liquid cooling system at least includes the gas extraction tube and the evaporator; condensing the gaseous medium in a condenser of the two-phase cold plate liquid cooling system to obtain a first liquid-phase medium corresponding to the gaseous medium; and controlling a nozzle of the two-phase cold plate liquid cooling system to spray the first liquid-phase medium into the outlet of the evaporator, where the first liquid-phase medium is used to absorb gaseous latent heat of the gaseous medium at the outlet of the evaporator. This application solves the technical problem of poor stability of the two-phase cold plate liquid cooling system.

A cooling device includes: a storage tank configured to store a liquid-phase first refrigerant below a heat generating body; a refrigerant supply unit configured to pump up the first refrigerant in the storage tank and supply the first refrigerant to the heat generating body; and a refrigerant cooling unit configured to cool the first refrigerant by supplying a second refrigerant having a lower temperature than the first refrigerant and performing heat exchange between the first refrigerant and the second refrigerant, and the storage tank recovers the first refrigerant supplied to the heat generating body.

A lattice heatsink is designed to provide efficient cooling in a small footprint. The lattice heatsink provides cooling directly, for example, to hot components of an electronic device, and more specifically provides cooling to hot components on a printed electronic circuit board (PCB). The lattice heatsink of the present invention achieves cooling without the need to bring heat out of a system with much bulkier and sizeable solutions.

A heat dissipation system includes a housing, an electronic device, an atomizer and a vacuum pump. The electronic device is disposed in the housing. The electronic device includes a heat source. The atomizer is disposed relative to the electronic device. The atomizer is configured to atomize and spray a working fluid to the heat source. The vacuum pump is connected to the housing. The vacuum pump is configured to vacuumize the housing. The heat dissipation system can effectively improve the heat dissipation effect through the cooperation of vacuuming and atomization mechanisms.

The present disclosure relates to a container structure and a server cluster, where the container structure includes: a box, in which a cold air channel and a hot air channel that are in communication with each other are formed; and a heat exchanger, disposed on the box and configured to exchange heat with air output from the hot air channel; where the heat exchanger has a heat exchange channel and an air channel, which are spaced apart; the heat exchange channel is respectively communicated with the cold air channel and the hot air channel, and can transmit air after heat exchange to the cold air channel; and an air exit and an air entrance of the air channel are disposed on adjacent sides of the heat exchanger.

The cooling system comprises a channel encompassing a heat source; a coolant-droplets introducer configured to introduce coolant droplets into the channel, wherein the coolant droplets vaporize as coolant gas in the channel due to heat generated by the heat source; a compressor configured to pump an air from a channel subspace into a condenser subspace, wherein the air comprises the coolant gas; and a condenser configured to condense the coolant gas into coolant droplets or coolant liquid. The coolant liquid is introduced to or for the coolant-droplets introducer.