The invention relates to a device for thermal regulation of a predefined number of electronic and/or electric components, in particular for a motor vehicle, the device including: a dielectric fluid circuit including at least one supply line, a predefined number of dielectric fluid spraying nozzles fluidically connected to the supply line and configured to be placed so as to wet at least one surface of the at least one component, and at least one dielectric fluid collector configured to be placed so as to collect the dielectric fluid after the spraying operation, the collector having at least one separating rib configured to extend between at least two components. The invention also relates to a thermal regulation unit including such a device.

A thermal control device for at least one module for a motor vehicle includes a dielectric fluid circuit and a number of nozzles for spraying dielectric fluid and configured to be arranged to wet at least one surface of the at least one module with dielectric fluid. The spray nozzles are configured to project, via at least one projection orifice, a fan shaped jet of dielectric fluid. The spray nozzles each include a projection channel configured to direct the dielectric fluid and at least one dielectric fluid deflector onto which the projection channel opens, to orient the dielectric fluid to create a fan shaped jet.

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

This application provides a flow rate control method and a computing node. The method is applied to a computing node, the computing node includes a housing, a to-be-cooled component, and a nozzle, and the to-be-cooled component and the nozzle are located in a closed cavity of the housing. The method includes: obtaining a node parameter of the computing node, where the node parameter includes at least one of the following: a processor parameter of a processor and pressure information of the closed cavity, and the to-be-cooled component includes the processor; and adjusting, based on the node parameter, a flow rate of a liquid cooling medium sprayed by the nozzle to the to-be-cooled component.

Embodiments of the present application provide a computing device and a computing node that meet a heat dissipation requirement of an internal to-be-cooled component without increasing occupied space. A housing of the computing node includes a bottom shell and an upper cover. The upper cover and the bottom shell form an accommodation cavity. A liquid cooling working medium is sprayed toward a to-be-cooled component by a spray assembly. A nozzle and a second joint of the spray assembly are disposed on the upper cover, and the second joint is in communication with the nozzle. A first joint of the spray assembly is located in the accommodation cavity and is in communication with a working medium inlet. The first joint and the second joint form a mating and communicating assembly to deliver the cooling working medium from the bottom shell to the nozzle.

A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

A storage device includes: a memory device; a memory controller; and a cooling unit configured to guide a flow of a cooling material to the memory controller, wherein the cooling unit includes a housing, a guide member, and a pump, wherein the housing covers the memory controller and includes a first point and a second point, wherein the first point is disposed at a first side of the housing, wherein the second point is disposed at a second side of the housing that is below the first side of the housing, wherein the guide member is attached to the housing and guides the flow of the cooling material from the first point toward the second point, and wherein the pump is configured to adjust an amount of the cooling material flowing from the first point to the second point.

The present disclosure provides methods and systems for heat exchange, such as cooling a heat source. A cooling system of the present disclosure may comprise a first channel that is configured to direct a liquid coolant, a second channel that is configured to direct a vapor coolant generated from the liquid coolant, and a condenser that is configured to permit the vapor coolant to undergo phase transition to the liquid coolant. The cooling system may further comprise at least one cooling interface in fluid communication with the first channel and the second channel. The cooling interface may be configured to facilitate heat exchange between the liquid coolant and a heat source.

Described are examples for improving heat transfer for a data center, which may include a hermetically sealed container having sides defining an interior portion that is able to hold pressurized gas or air, a data center computer server located within the interior portion, and a spray device located within the interior portion for spraying a non-corrosive fluid over the data center computer server to, in conjunction with the pressurized gas or air, cool at least a portion of the data center computer server.

A sealed server unit is described. The server unit utilises a combination of air and liquid cooling to effect a cooling of the electronic components within the server unit. By sealing the unit to ambient conditions it is possible to deploy the server unit in non-traditional environments.