The present invention discloses an external thermal conduction interface structure of electrical equipment wherein a fluid jetting device is utilized to jet a thermal conductive fluid for exchanging heat with the external thermal conduction interface structure of electrical equipment via the thermal energy of the jetted thermal conductive fluid, the heat exchange means includes the external thermal conduction interface structure of electrical equipment having relative high temperature being cooled by a fluid have relative lower temperature, and external thermal conduction interface structure of electrical equipment having relative lower temperature being heated by a fluid having relative higher temperature.

An impingement cooling system includes a porous heat spreader and a nozzle configured to direct a fluid as a jet and/or as a spray impinging upon the porous heat spreader. The porous heat spreader is made of a thermally-conductive material such as a metal, metal alloy, carbon/graphite, or ceramic, and is in thermal contact with a heat source. The nozzle may be configured to direct the fluid as a jet comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The nozzle may be configured to direct the fluid as a spray comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The cooling system may include one or more nozzles, which may direct the cooling fluid orthogonally or at an oblique angle to an impingement plate.

A water injector for an aviation cooling system includes a body having a first end, a second end, and an intermediate portion extending therebetween. A conduit extends through the body from the first end to the second end. A spray nozzle is fluidically connected to the conduit and arranged at one of the first end and the second end. A mounting plate is arranged at the other of the first end and the second end. The mounting plate is configured and disposed to secure the body to an aviation cooling component. A filter is supported at the body and is fluidically exposed to the conduit. The filter is configured and disposed to capture particulate flowing into the water injector towards the spray nozzle.

Described are examples for improving heat transfer for a data center, which may include a hermetically sealed container having sides defining an interior portion that is able to hold pressurized gas or air, a data center computer server located within the interior portion, and a spray device located within the interior portion for spraying a non-corrosive fluid over the data center computer server to, in conjunction with the pressurized gas or air, cool at least a portion of the data center computer server.

A cooling apparatus for an electronic element includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit.

A cooling device includes a heat sink that includes a plurality of first heat radiating fins and a plurality of second heat radiating fins, and a compressor as a blower that causes cooling air to flow from an inlet toward an outlet of a cooling passage of the heat sink. The cooling device includes in a flow direction of the cooling air that passes via the heat sink a mist supplier arranged upstream of the heat sink and that supplies mist M to the cooling passage of the heat sink.

A heat dissipation device for an electronic element includes a first chamber containing a printed circuit board with heating elements, and a second chamber for heat exchange. The second chamber contains a refrigerant injection part and supply part. A heat transfer part between the chambers receives heat from the heating elements and transfers it to the second chamber. A condensing part condenses injected refrigerant. The heat transfer part has evaporation-inducing ribs on its surface exposed to the second chamber, allowing injected liquid refrigerant to be adsorbed and flow downward in a zigzag pattern. This configuration enables efficient heat dissipation through phase changes of the refrigerant as it evaporates and condenses. The device may also include features like specially-shaped condensation ribs, a blower part to improve condensation, and a pressure regulator for the second chamber. This design provides improved heat dissipation performance without increasing device size.

An impingement cooling system includes a porous heat spreader and a nozzle configured to direct a fluid as a jet and/or as a spray impinging upon the porous heat spreader. The porous heat spreader is made of a thermally-conductive material such as a metal, metal alloy, carbon/graphite, or ceramic, and is in thermal contact with a heat source. The nozzle may be configured to direct the fluid as a jet comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The nozzle may be configured to direct the fluid as a spray comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The cooling system may include one or more nozzles, which may direct the cooling fluid orthogonally or at an oblique angle to an impingement plate.

The disclosure provides an evaporative cooling logic control method and apparatus of an inductive vibration device. The method includes the following steps: S1, starting a vibration device, and acquiring data; and S2, displaying an effective output current by a power amplifier, and judging whether the effective output current is larger than 600 amperes or not. The method has the beneficial effects that a spray auxiliary cooling mode of the inductive vibration device, which is adjusted by the logic control method of the disclosure, has simple structure and reliable function, the phenomenon of insufficient induced draft and heat dissipation capacity of the prior fan of the moving coil induction ring can be effectively solved, the radial expansion can be reduced, and the method is especially suitable for heat dissipation of the moving coil induction ring of the inductive vibration device with large moving coil induction ring current and large.

A sealed server unit is described. The server unit utilises a combination of air and liquid cooling to effect a cooling of the electronic components within the server unit. By sealing the unit to ambient conditions it is possible to deploy the server unit in non-traditional environments.