A heat pipe (10) for cooling an electronic device, especially a component carrier (100), that comprises a central section (13) with a cavity (12) filled with a heat transfer fluid (20). In longitudinal direction (11) of the heat pipe (10) directly connected with the central section (13) are a first end section (14) on a first end of the central section and a second end section (15) on the opposite second end of the central section, wherein the first end section and the second end section each comprise a landing structure (17) with a surface length (SL, SL.sub.1, SL.sub.2) and a surface width (SW, SW.sub.1, SW.sub.2) and wherein each landing structure is thermoconductively coupled with the central section of the heat pipe. A component carrier comprising at least one heat pipe for cooling it, and a method for producing the component carrier are also provided.

A water injector for an aviation cooling system includes a body having a first end, a second end, and an intermediate portion extending therebetween. A conduit extends through the body from the first end to the second end. A spray nozzle is fluidically connected to the conduit and arranged at one of the first end and the second end. A mounting plate is arranged at the other of the first end and the second end. The mounting plate is configured and disposed to secure the body to an aviation cooling component. A filter is supported at the body and is fluidically exposed to the conduit. The filter is configured and disposed to capture particulate flowing into the water injector towards the spray nozzle.

A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.

There is described a spray chamber for cooling a computer processor on a circuit board. The spray chamber comprises: a wall assembly for sealable mounting on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the top surface of the computer processor; and a lid for covering the top opening of the wall assembly in a sealable manner, the lid having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor.

A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone.

The present invention relates to a process for removing heat, comprising the steps of: generating liquid fine particles comprising at least one vaporable liquid; transporting the liquid fine particles to a heat source; and vaporizing the liquid fine particles in the vicinity of the heat source without contacting the liquid fine particles with the heat source, wherein the heat of the heat source is removed by the heat of vaporization of the liquid fine particles, as well as a system for removing heat which can perform the process for removing heat. The process and system for removing heat according to the present invention can exert high cooling efficiency because they can directly remove heat from the heat source.

A modular cooling system for data center. An airflow section forms a duct for air flow and a plurality of core units are serially attached to each other and to the airflow section. A blower unit is attached to each of the core units. A plurality of motorized dampers are provided: between each of the core units and the airflow unit, in between each two core units, and between each core unit and its corresponding blower unit. A plurality of fluid ports are attached to each of the core units. At least one of the core units is loaded with one or more equipment selected from: air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, a cooling tower or other types of cooling equipment. A combination operation of the components on the compartment and the cooling units enables fast deployment and operation.

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

A system including a heat exchanger section for re-cooling a heated liquid coolant, a spray cooling section for cooling an electronic equipment; mean for separating said heat exchanger or pump section from said spray cooling section; means for transferring heat generated by the electronic equipment to at least liquid coolant; means for spraying the liquid coolant along the heat transferring means to transfer heat from the electronic equipment to the liquid coolant; wherein the heat transferring means is in an essentially vertical position so that the liquid coolant generally flows downward and is drained by gravity; means for collecting the liquid coolant; means for suctioning the collected liquid coolant; means for pumping the dielectric liquid coolant from the sprayed liquid coolant collecting means and through the liquid coolant spraying means; and means for housing the system.