A heat dissipation module being disposed in an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, a magnetic field generator and a plurality of magnetic powder. The heat source is heat conducting to the evaporator. The pipe is connected to the evaporator to form a loop therewith, and a working fluid is filled in the loop. The magnetic field generator is disposed outside of the evaporator. The magnetic powder is movably disposed in the evaporator. A magnetic field generated by the magnetic field generator drives the magnetic powder to form a channel in the evaporator where the working fluid passes through. The heat generated by the heat source is transmitted to the evaporator, and the working fluid in liquid phase absorbs the heat and is phase-transited to vapor phase and flows from the evaporator towards the pipe.

A mobile terminal comprises: a metallic frame; a first cover and a second cover coupled to a front surface and a rear surface of the metallic frame, respectively; and a first waterproof layer and a second waterproof layer formed between the first cover and the metallic frame, and between the second cover and the metallic frame, respectively, wherein the metallic frame includes: a base portion configured to support a display unit formed on the front surface of the metallic frame; and an edge portion formed along an outer periphery of the base portion so as to radiate heat generated from the base portion, and exposed to outside of the mobile terminal between the first cover and the second cover.

A power tool with a combined printed circuit board (PCB) that reduces internal wiring of the power tool and provides a large amount of air flow to internal components. In some instances, the combined PCB has a surfboard shape and includes a motor control unit and power switching elements (Field Effect Transistors or FETs). The combined surfboard PCB is located above the trigger, but below the motor and drive mechanism. In other instances, the combined PCB has a doughnut shape and is located coaxially with a motor shaft. The combined PCB may be positioned between a doughnut-shaped control PCB and the motor.

An electronic device for motor vehicles comprises a heat-conducting housing containing a printed circuit board and an element producing heat mounted on the printed circuit board. The housing comprises a housing base on which the printed circuit board is mounted and comprises a cover opposite to the housing base. A first heat-dissipating metal structure is mounted on the element producing heat, and a second heat-dissipating metal structure, formed as part of the cover of the housing and protruding into the housing, is coupled with the first heat-dissipating metal structure, in such a manner as to facilitate the dissipation of the thermal energy from the element producing heat towards the outside of the housing.

Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.

A heat release device includes a housing, a substrate located within the housing, a heat source disposed on the substrate, a first member provided between the housing and the substrate and between the housing and the heat source, and a plurality of second members that support the first member from the substrate. The first member is disposed to have a gap with the heat source and so as to have a gap with the housing. Among the plurality of second members, a second member far from the heat source is larger in area in contact with the substrate and the first member than a second member close to the heat source.

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.

The present disclosure provides an electrical connector comprising a housing and a radiator. The radiator is disposed on the housing, comprising a fluid flowing space, a fluid input port, and a fluid output port. The fluid input port and the fluid output port are communicating with the fluid flowing space. Fluid flows through the fluid input port to the fluid flowing space. The fluid absorbs the thermal energy generated by a mating connector plugged into the electrical connector. The fluid absorbing the thermal energy generated by the mating connector flows through the fluid output port to external.