A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

A connector assembly is provided and includes a guide shielding cage and a heat sink module. The guide shielding cage has at least one insertion space positioned inside. The heat sink module includes a heat dissipating member, a pressure applying elastic member, a lever member and a supporting elastic member, the heat dissipating member has a thermal coupling portion formed downwardly, the pressure applying elastic member is provided at a side face of the heat dissipating member, the lever member is pivoted to the guide shielding cage, the lever member has a pushed end which is used to be pushed and a pressure applying end which is used to downwardly apply a pressure to the pressure applying elastic member, the supporting elastic member upwardly and elastically supports the heat dissipating member. The heat dissipating member is capable of moving between a releasing position which is higher relative to the insertion space and an acting position which is lower relative to the insertion space and where the thermal coupling portion enters into the insertion space.

A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.

An electronic device is provided. The electronic device includes a protective cover, an electronic module, and a heat exchanger. The protective cover has an opening. The electronic module is disposed below the protective cover. The heat exchanger is disposed between the protective cover and the electronic module. A sub-space is defined between the heat exchanger and the protective cover. The heat exchanger has a first flow path and a second flow path. The first flow path and the sub-space communicate. The second flow path and the opening communicate. The first flow path is isolated from the second flow path.

A cooling device for an object detection sensor, having a sensor-side heat transmission element, a sensor-distant heat absorption element, wherein the sensor-side heat transmission element and the sensor-distant heat absorption element are arranged opposite to one another, wherein a heat transmission surface of the sensor-distant heat transmission element and a heat absorption surface of the sensor-distant heat absorption element are designed to be spaced apart from one another by an intermediate space. Furthermore, an object detection sensor including such a cooling device is described.

The present disclosure provides a connector assembly comprising a shielding cage and a liquid cooling cabin. The shielding cage has an insertion space and a window in communication with the insertion space. The liquid cooling cabin is configured to allow a cooling liquid to circulate and flow inside, the liquid cooling cabin comprises a shell having an opening, a thermal coupling cover provided at the opening of the shell, and an elastic sealing unit sealing a gap between the thermal coupling cover and the shell, the thermal coupling cover having a thermal coupling plate entering into the insertion space via the window of the shielding cage, the thermal coupling plate being capable of elastically moving in a direction close to the shell and elastically restoring in a direction away from the shell by a function of the elastic sealing unit.

An electronic control device includes a housing that stores a substrate on which an electronic component is mounted, a first capacitance unit formed between the housing and the electronic component, and a second capacitance unit formed between the housing and the substrate, in which a noise transmission path is formed between the housing and the substrate via the first capacitance unit and the second capacitance unit.

A power supply enclosure is disclosed in this application, the power supply enclosure includes a housing and a fixing plate. The housing has an accommodation cavity, and a first flow channel is disposed in the housing. The fixing plate is located in the accommodation cavity, at least a part of a surface of the fixing plate that faces the housing is fixedly connected to at least a part of an inner surface of the housing, and the fixing plate is configured to fix a power supply conversion functional assembly, so as to perform heat dissipation on a heat generating component in the power supply conversion functional assembly by using a cooling fluid in the first flow channel.

An electronic device includes a housing and a first heat source, a second heat source, and a heat dissipation module that are disposed in the housing. The heat dissipation module includes a first fan, a second fan, a first heat conduction member, and a second heat conduction member. The first fan and the second fan are disposed on two opposite sides of the housing. One end of the first heat conduction member is disposed at the first fan, and the other end is located at a position on a side of an upper surface of the housing corresponding to the first heat source. One end of the second heat conduction member is disposed at the second fan, and the other end is located on a side of a lower surface of the housing and abuts against the second heat source.

An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.