A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

The present invention refers to an electronic control (1) of a compressor (2), the electronic control (1) disposed in an encasement 5 (3), wherein the electronic control (1) comprises: a main board (4) associated to at least an auxiliary board (5,6,7), wherein one of the auxiliary boards (5,6,7) is a heat-generating board (7), wherein the heat-generating board (7) is disposed at a first distance (D.sub.1) in relation to a first wall of the encasement (P.sub.1), wherein the other auxiliary boards 0 (5,6) are disposed at least at a second distance (D.sub.2, D.sub.3) in relation to the first wall of the encasement (P.sub.1), wherein the first distance (D.sub.1) is less than the second distance (D.sub.2). A compressor (2) and a cooling equipment are also described.

Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

An electronic device includes: a casing including a bottom wall and a side wall rising from the bottom wall, the side wall being attached to a manifold of an actuator in an aircraft at an opposite side to the bottom wall; a boss projecting from the bottom wall toward the opposite side to the bottom wall with respect to the side wall; and a circuit portion fixed to the boss.

Embodiments of the disclosure relate generally to thermal control and management in hardware devices. A thermal control system includes a thermal node, a thermal bridge, and a thermal controller. The thermal node is configured to receive heat generated in a device. The thermal controller is configured to in response to an environment temperature of the thermal controller being greater than a first threshold temperature, cause heat transfer from the thermal node to a first heat sink and prevent heat transfer from the thermal node to a second heat sink. The thermal controller is also configured to, in response to the environment temperature of the thermal controller being greater than a second threshold temperature, cause heat transfer from the thermal node to the second heat sink and prevent heat transfer from the thermal node to the first heat sink.

Disclosed are an electrical apparatus, a method for manufacturing an electrical apparatus, and a motor vehicle, and the electrical apparatus. In the apparatus, a chamber includes a first electrical element located at a first position and a second electrical element located at a second position, the first electrical element and the second electrical element having different heat dissipation characteristics. The electrical apparatus further includes a potting spacer, the potting spacer separating the chamber into two sub-chambers: a first sub-chamber and a second sub-chamber. The first electrical element is located in the first sub-chamber, and the second electrical element is located in the second sub-chamber.

An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.

Separating temperature domains in cooled systems, including: cooling at least one first component of a circuit board using a first cooling system; and conductively coupling the at least one first component to at least one second component using a superconductive portion of a power plane of the circuit board.