A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

A method for assembling a modular cooling system includes attaching a support manifold to a first rail of an equipment rack, the support manifold defining a coolant supply channel and a coolant return channel; and mounting a first cold plate to the support manifold including engaging a manifold supply connector with a plate supply connector in fluid communication, the manifold supply connector being connected in fluid communication with the coolant supply channel of the support manifold, the plate supply connector being connected in fluid communication with a cooling system disposed within the first cold plate.

Systems, methods, and other embodiments associated with unified control of cooling in computers are described. In one embodiment, a method locks operation of first and second cooling mechanisms configured to cool one or more components in the computer. In response to a first condition, the method unlocks the operation of the first cooling mechanism to allow the first cooling mechanism to make cooling adjustments while the operation of the second cooling mechanism is locked. In response to a second condition, the method unlocks the operation of the second cooling mechanism to allow the second cooling mechanism to make cooling adjustments while the operation of the first cooling mechanism is locked. In the method, the first cooling mechanism and the second cooling mechanism are prevented from making the cooling adjustments simultaneously.

A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.

Systems, methods, and other embodiments associated with unified control of cooling in computers are described. In one embodiment, a method locks operation of first and second cooling mechanisms configured to cool one or more components in the computer. In response to a first condition, the method unlocks the operation of the first cooling mechanism to allow the first cooling mechanism to make cooling adjustments while the operation of the second cooling mechanism is locked. In response to a second condition, the method unlocks the operation of the second cooling mechanism to allow the second cooling mechanism to make cooling adjustments while the operation of the first cooling mechanism is locked. In the method, the first cooling mechanism and the second cooling mechanism are prevented from making the cooling adjustments simultaneously.

A negative pressure liquid cooling system and a method for controlling a negative pressure liquid cooling system are provided, and the negative pressure liquid cooling system separately controls pressures at an inlet and an outlet of a cold plate, so that the pressures at the inlet and the outlet of the cold plate remain negative. In this way, when a pipeline between the inlet and the outlet of the cold plate is perforated, a pressure at the outlet of the cold plate can be separately controlled to remain negative, so that a coolant is suppressed in the pipeline, and a coolant leakage phenomenon is avoided. Therefore, damage or a security threat to a to-be-cooled electronic device that is caused by leakage of a conductive operating medium such as water is avoided.

A cooling module includes an electroosmotic pump. The electroosmotic pump includes a first electrode which is permeable to a cooling fluid, a second electrode which is located with an interval from the first electrode and is permeable to the fluid, and a dielectric layer which is located between the first electrode and the second electrode and includes a microchannel which is permeable to the fluid. The first electrode and the second electrode have different polarities.

A fluid distribution apparatus and a fluid distribution module with choke are provided. The fluid distribution apparatus includes a first fluid conveying pipe, a second fluid conveying pipe, multiple fluid manifolds located between the first fluid conveying pipe and the second fluid conveying pipe and connected with the first fluid conveying pipe and the second fluid conveying pipe, an inlet disposed on a side of the first fluid conveying pipe and between both ends of the first fluid conveying pipe; and an outlet disposed on a side of the second fluid conveying pipe and set corresponding to a position where the inlet is set. The fluid is supplied from the inlet to the first fluid conveying pipe, and the fluid is conveyed to the fluid manifolds along the first fluid conveying pipe, and flows into the second fluid conveying pipe through the fluid manifolds and flows out from the outlet.

A fluid distribution apparatus and a fluid distribution module with choke are provided. The fluid distribution apparatus includes a first fluid conveying pipe, a second fluid conveying pipe, multiple fluid manifolds located between the first fluid conveying pipe and the second fluid conveying pipe and connected with the first fluid conveying pipe and the second fluid conveying pipe, an inlet disposed on a side of the first fluid conveying pipe and between both ends of the first fluid conveying pipe; and an outlet disposed on a side of the second fluid conveying pipe and set corresponding to a position where the inlet is set. The fluid is supplied from the inlet to the first fluid conveying pipe, and the fluid is conveyed to the fluid manifolds along the first fluid conveying pipe, and flows into the second fluid conveying pipe through the fluid manifolds and flows out from the outlet.

Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.