Patent classifications
H05K7/207
Composite Cooling System and Data Center
This application provides a composite cooling system. The composite cooling system includes an indoor air duct and an outdoor air duct that are independent of each other. The indoor air duct and the outdoor air duct intersect in a heat exchange area of the composite cooling system. A first-stage heat exchanger core, a second-stage heat exchanger core, and a first side air duct are disposed in the heat exchange area. The heat exchange area is constructed as a part of the outdoor air duct. The first-stage heat exchanger core, the first side air duct, and the second-stage heat exchanger core are sequentially arranged along a flow direction of the outdoor air duct. An inner cavity of the first-stage heat exchanger core and an inner cavity of the second-stage heat exchanger core each are further constructed as a part of the indoor air duct.
MULTI-TEMPERATURE CONTROL CABINET AND SCHEDULING METHOD FOR MULTI-TEMPERATURE CONTROL CABINET
The multi-temperature control cabinet includes a cabinet body, a cabinet door, and a refrigerating system. The refrigerating system includes at least one air conditioner, at least one direct ventilation unit, and an environment monitoring apparatus. Both the air conditioner and the direct ventilation unit are disposed on the cabinet door, and the air conditioner and the direct ventilation unit are disposed in parallel in a height direction of the cabinet door. An air guide assembly is disposed between the direct ventilation unit and an air exhaust vent of the air conditioner. The environment monitoring apparatus is connected to both the air conditioner and the direct ventilation unit, and the environment monitoring apparatus is configured to monitor temperature and humidity in the cabinet body, and control turning-on and turning-off of the air conditioner and the direct ventilation unit based on the temperature and the humidity in the cabinet body.
EMBEDDED SYSTEM MODULE THERMAL INSTALLATION VERIFICATION
Systems and methods for detecting an incorrectly attached heat sink component on an electronic device. The system includes one or more temperature sensors secured to the electronic device and a controller unit comprising one or more processors and one or more computer-readable media, the computer-readable media having stored thereon executable instructions that are executable by the one or more processors to perform a method for detecting incorrectly attached heat sink components. The method includes receiving temperature data, calculating a thermal ramp rate, comparing the thermal ramp rate to a predetermined threshold ramp rate, and transmitting a fault signal when the calculated thermal ramp rate exceeds the predetermined threshold ramp rate.
Fan control system and method thereof
Provided are a fan control method and a fan control system. The fan control method of the present invention includes the steps of predetermining a reliable operating temperature of a hard disk; creating a storing a corresponding relationship between an average hard disk temperature and a fan speed, and creating and storing a corresponding relationship between a hard disk temperature greater than the reliable operating temperature and a fan speed; reading actual temperatures of the plurality of hard disks; comparing the actual temperatures of the plurality of hard disks with the reliable operating temperature; computing an average temperature of the plurality of hard disks; and outputting a control signal to adjust the fan speed based on the stored corresponding relationship between an average hard disk temperature and a fan speed. Accordingly, the present invention may increase hard disk reliability and decrease power dissipation of a fan and system noise.
SYSTEMS AND METHODS OF REAL TIME OPTIMUM AIRFLOW BALANCING ON RACK LEVEL AIRFLOW CONSTRAINT
A central information management console provides for real time management of airflow across an information handling system or across multiple information handling systems within one or multiple racks within an environment by estimating and prioritizing the volumetric airflow needs of each information handling system within the environment. Each information handling system or group of information handling systems may be given a priority setting based on one or more criteria and volumetric airflow may be provided based on the priority setting and a selected balancing option. Metrics and sensor readings are received by the central information management console in real time or at intervals to use in determining the amount of volumetric airflow to provide to each information handling system so as to balance volumetric airflow for efficient operation of the environment and to maintain volumetric airflow so as not to exceed a volumetric airflow limit.
THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS
A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.
ASSISTANCE APPARATUS, ASSISTANCE METHOD, AND PROGRAM
An assistance apparatus according to the disclosure generates monitor area data on the basis of dimension data of rack rows that are each constituted by a plurality of racks and that are arranged in a first direction in a three-dimensional space, the dimension data including the length of each rack row in the first direction and the height thereof in a second direction perpendicular to the first direction, interval data that includes an interval, in a third direction, between the rack rows adjacent to each other in the third direction, the third direction being perpendicular to the first and second directions, field-of-view angle data that includes the field-of-view angle of each temperature sensor, and temperature sensor position data that indicates certain temperature sensor positions; and includes a display control unit that displays monitor coverage information on a display device on the basis of the monitor area data.
OPTIMIZED AND INTELLIGENT FAN CONTROL MECHANISM INSIDE RACK SYSTEM
Disclosed are a system, method, and computer-readable medium for optimizing a fan control system inside a rack system. In at least one example embodiment, the system can include a rack server with a plurality of chassis each having at least one node, each of the nodes including at least one adjustable air vent and configured for adjusting the at least one adjustable air vent based on an air flow requirement of the node. The system can further include a plurality of fans, where the plurality of fans are configured to operate based on a control signal. The system also can comprise a fan control logic board, wherein the fan control logic board is configured to receive from each node in the plurality of chassis the air flow requirements and based on the plurality of air flow requirements generate and transmit the control signal to the plurality of fans.
Systems and methods for generating in a graphical user interface a display representing air temperatures, pressures, and velocities in an information technology room
A system for determining and displaying in a graphical user interface one or more of air temperature, pressure, or velocity in an information technology (IT) room including an IT equipment rack comprises a processor configured to receive an input comprising airflow resistance parameters through the rack, an IT equipment airflow parameter, a heat-dissipation parameter, an external pressure, and an external temperature, to run the input through a flow-network solver that solves for airflow velocities through at least one face of the rack and a rack air outflow temperature based on the input, provide an output including the airflow velocities and the rack air outflow temperature, and generate, based on the output, a display in a graphical user interface of the system illustrating one or more of air temperatures, air pressures, or airflow velocities within the IT room.
Method and apparatus for controlling subrack fans
Disclosed are a method and an apparatus for controlling subrack fans. The method comprises: by installing multiple boards installed with high-power components in different areas of a subrack respectively, forming multiple heat dissipation air channels corresponding to the multiple boards respectively; installing a fan group comprising multiple heat dissipation fans on the subrack; dividing the fan group into multiple fan areas corresponding to the multiple heat dissipation air channels respectively, so that each fan area blows air to a corresponding board through a corresponding heat dissipation air channel; detecting temperature of each board and a rotating speed of a corresponding fan area in real time; adjusting the rotating speed of the fan area according to a detection result, so that the rotating speed of the fan area increases or decreases as the temperature of the corresponding board increases or decreases. Also disclosed is the apparatus for controlling subrack fans.