In accordance with the embodiments of the present disclosure, a rack comprising a frame having first vertical posts on a first side and second vertical posts on a second side, between which a plurality of RF amplifier modules are mounted, is provided. The RF power outputs of the RF amplifier modules are connected to inputs of an RF power combiner to deliver a combined RF power output. The RF power combiner is arranged at least partially in at least one of a first volume between the first vertical posts of the frame or a second volume between the second vertical posts of the frame, thereby reducing a footprint of the rack.

An airflow characterization system includes a first airflow sensor subsystem positioned at a first location on an airflow characterization board base and a second airflow sensor subsystem positioned at a second location on the airflow characterization board base that is different than the first location. An airflow characterization controller is coupled to the first airflow sensor subsystem and the second airflow sensor subsystem. When the airflow characterization board is positioned in a circuit board slot, the airflow characterization controller receives a first airflow signal from the first airflow sensor subsystem during a first time period and receives a second airflow signal from the second airflow sensor subsystem during the first time period. The airflow characterization controller determines a circuit board slot airflow characterization for the circuit board slot based on the first airflow signal and the second airflow signal.

Automatic monitoring of a cooling system and providing warnings of abnormal operation. The cooling system includes one or more air handling units to provide air flow cooling to a plurality of racks of computer equipment, each rack having a display module for indicating an inlet air temperature of the rack and an alert message. The monitoring includes: receiving, from a plurality of sensors, measurements of: an air flow temperature provided to each of the racks; and an air pressure, temperature and relative humidity difference across, and an electrical power consumption of, the air handling unit(s); updating a computer model of the cooling system with the received measurements; and for each rack, if a level or a rate of change of the inlet air temperature is outside of a preset range for the rack, transmitting an alert message to the display module to indicate a cause based on the computer model.

A system for providing cooling to electronic modules received within a chassis. The chassis includes a cooling apparatus having ducting and a plurality of fans coupled to the ducting. The ducting includes air passageways that extend through the ducting and are configured to direct air blown into the passageways by the fans toward the modules installed in the chassis. The modules include heat sinks and the air passageways direct the air toward the fins to provide cooling to the heat sinks. The chassis includes switches coupled to the fans and configured to selectively activate the individual fans when the electronic modules are installed in the chassis.

A module panel and method include an exterior housing, at least one heat sink disposed in the housing, a power delivery circuit disposed in the housing and coupled to one side of the at least one heat sink, and a controller circuit disposed in the housing and coupled to an opposite side of the at least one heat sink. The power delivery circuit operates using one or more different voltages than the controller circuit.

A cooling system, in particular for electronics cabinets, is proposed, comprising a casing, wherein the casing comprises at least a cabinet side partitionment, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, wherein the second cooling circuit is an active cooling circuit, wherein the first cooling circuit and the second cooling circuit are thermally coupled, wherein the second cooling circuit is not disposed in the cabinet side partitionment.

In accordance with the embodiments of the present disclosure, a rack comprising a frame having first vertical posts on a first side and second vertical posts on a second side, wherein the first side is opposite the second side, between which a plurality of RF amplifier modules are mounted, is provided. The RF power outputs of the RF amplifier modules are connected to inputs of an RF power combiner to deliver a combined RF power output. The RF power combiner is arranged at least partially in at least one of a first volume between the first vertical posts of the frame or a second volume between the second vertical posts of the frame, thereby reducing a footprint of the rack.

A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

An active heat-dissipation system for a base station of a communication system includes a measuring module, configured to detect a temperature sensing signal of the base station; a controller, configured to receive the temperature sensing signal detected by the measuring module to set a preset temperature signal, to generate a difference between the temperature sensing signal and the preset temperature signal and a time derivative of the difference, and to output a control signal according to the difference and the time derivative of the difference based on a control program; and a power module, configured to receive the control signal and output an electrical signal to a heat-dissipation module according to the control signal, such that the heat-dissipation module performs a heat-dissipation process for the base station according to the electrical signal.

A system for managing temperature, that can be adapted to an electrical enclosure, the electrical enclosure delimiting a first volume, the system comprising: a first chamber delimiting a closed second volume and a tank housed in the first chamber and delimiting a closed third volume inside the first chamber, first air transfer means arranged between a first air inlet/outlet connected to the second volume and a second air inlet/outlet intended to be connected to the first volume, second air transfer means arranged between a third air inlet/outlet connected to the third volume and a fourth air inlet/outlet intended to be connected to the first volume, and a control and processing unit intended to apply a mode of operation of the system.