An equipment assembly for cooling heat-generating electrical components is disclosed. The assembly includes a housing for containing a heat-generating electrical component. The housing includes an open end having a planar area. A closed-loop liquid cooling system includes a liquid coolant conduit in proximity to the heat-generating electrical component. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating electrical component. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from circulated liquid coolant within the heat exchanger. The heat exchanger includes a shaped front facing the open end of the housing. The surface area of the shaped front is greater than the planar area of the open end. An air flow system propels ambient air through the shaped front of the heat exchanger.

An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

According to one embodiment, a battery backup system includes an output terminal, one or more BBUs coupled in parallel to provide backup power to an external electronic device coupled to the output terminal, and a control circuit to control the power distribution from the BBUs. Each of the BBUs includes a battery pack having one or more battery cells and a converter to regulate and output power to the output terminal. The control circuit is configured to control a duty cycle for each of the BBUs, which when used to drive the BBU, adjusts power output in order to balance charges amongst the BBUs. The duty cycle of each BBU is determined based on an output voltage across the output terminal, an output current flowing through the output terminal, and characteristics of the battery pack of the BBU.

There is disclosed a system and method for transferring waste heat from integrated circuits. In an embodiment, the system comprises: a self-contained enclosure having integrated circuits therein, the self-contained enclosure further including: a first fluid circuit configured for removing waste heat from the integrated circuits; an inlet for connection from an external water tank and an outlet for connection to the external water tank, that when connected with the external water tank forms a second fluid circuit; a heat exchanger operatively connected to the first fluid circuit and the second fluid circuit, and configured to transfer thermal energy therebetween; and a control for regulating a temperature gradient and a flow rate in each of the first and second fluid circuits, such that both a desired integrated circuit operating temperature and a desired water tank temperature is achieved. A plurality of self-contained enclosures co-located with water tanks may form nodes of a distributed computing and heating network.

A waste heat utilization system of an immersed liquid cooling heat dissipation device. The immersed liquid cooling heat dissipation device (100) comprises a liquid cooling tank (110). The liquid cooling tank (110) comprises an oil tank inlet (111) and an oil tank outlet (112). The system further comprises a waste heat utilization device (200). The waste heat utilization device (200) comprises a waste heat utilization body (210), a cold oil outlet (220) and a hot oil inlet (230), the cold oil outlet (220) and the hot oil inlet (230) being connected to the waste heat utilization body (210); the cold oil outlet (220) is connected with the oil tank inlet (111); the hot oil inlet (230) is connected to the oil tank outlet (112); the waste heat utilization body (210) is connected to a heat utilization end (300).

A cooling system of server includes a tank, a case body, a multi-hole box, a first dehumidifying material, a first tube, and a second tube. The tank is configured to accommodate a dielectric fluid. The multi-hole box is disposed in the case body. The first dehumidifying material is disposed in the multi-hole box. The first tube includes a first gas-inlet/outlet end and a second gas-inlet/outlet end respectively connected to the tank and the case body. The second gas-inlet/outlet end is connected to the first dehumidifying material. The second tube includes a liquid-inlet end and a liquid-outlet end respectively connected to the case body and the tank.

This disclosure describes systems for arranging racks within a data center for a smaller and/or more flexible footprint, more efficient and/or resilient cooling, and/or easier installation. In some examples, this disclosure describes a data center rack system that includes an aisle and a plurality of rack stations adjacent to the aisle. The aisle includes an aisle guidance track defining an aisle axis. Each rack station of the plurality of rack stations includes a station guidance track defining a station axis. The station guidance track is configured to receive a rack from the aisle guidance track and position the rack in the respective rack station at a rack angle formed between the aisle axis and the station axis that is less than 90 degrees.

An immersion cooling system includes a receiving member, a heat dissipation channel, and a heat sink. The receiving member is filled with coolant. The receiving member is connected to an end of the heat sink, and heat-generating entities such as one or more servers are positioned in a cavity of the receiving member. The heat dissipation channel is connected to the cavity and is connected to the heat sink. The heat dissipation channel communicates with the cavity and allows circulation of the coolant in the channel, the heat sink cooling down the coolant flowing into heat dissipation channel from the cavity. The immersion cooling system is compact, occupies very little space, and is easily installed, maintained, and moved. A server system having the immersion cooling system is also disclosed.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a thermal buffer is provided to collect coolant from a plurality of coolant distribution units (CDUs), to enable thermal stability for the coolant within the thermal buffer, and to facilitate a cooling loop with one or more cooling manifolds associated with at least one computing device.

A cooling system of server includes a tank, a case body, a multi-hole box, a first dehumidifying material, a first tube, and a second tube. The tank is configured to accommodate a dielectric fluid. The multi-hole box is disposed in the case body. The first dehumidifying material is disposed in the multi-hole box. The first tube includes a first gas-inlet/outlet end and a second gas-inlet/outlet end respectively connected to the tank and the case body. The second gas-inlet/outlet end is connected to the first dehumidifying material. The second tube includes a liquid-inlet end and a liquid-outlet end respectively connected to the case body and the tank.