A system for providing continuous cooling to a storage rack, including a storage rack, including a first storage node and a second storage node; a first cooling loop including a first cooling distribution unit (CDU); a second cooling loop including a second cooling distribution unit (CDU); a first inlet switching valve coupled between the first storage node and each of the first and the second CDUs; a second inlet switching valve coupled between the second storage node and each of the first and the second CDUs; wherein, when the first cooling loop experiences a failure, a state of the first inlet switch and a state of the second inlet switch is adjusted to i) prevent the first CDU from providing cooling of the first storage node and the second storage node, ii) allow only the second CDU to provide cooling of the first storage node and the second storage node.

An apparatus for cooling a plurality of rack-mountable servers containing heat generating electronic components in a server room including a dielectric liquid cooling apparatus located inside the tank and a secondary cooling apparatus comprising a remote heat exchanger and at least one pump. The volume of dielectric liquid coolant comprises at least one passage in the tank that is outside of the vertically oriented rack-mountable servers. When the at least one pump is operated to move the dielectric liquid coolant vertically across the heat producing components on the vertically oriented servers, a circuit is formed in which a first portion of dielectric liquid coolant is moved vertically upward across the heat producing components on the vertically oriented servers and then downward outside of the rack mountable servers in the at least one passage, while a second portion of the dielectric liquid coolant flows out of the tank.

A reliable, leak-tolerant liquid cooling system with a backup air-cooling system for computers is provided. The system may use a vacuum pump and a liquid pump and/or an air compressor in combination to provide negative fluid pressure so that liquid does not leak out of the system near electrical components. Alternatively, the system can use a single vacuum pump and a valve assembly to circulate coolant. The system distributes flow and pressure with a series of pressure regulating valves so that an array of computers can be serviced by a single cooling system. A connector system is provided to automatically evacuate the liquid from the heat exchangers before they are disconnected. Leak detection and mitigation structures are also disclosed. Various turbulators are also provided, as well as a system and method for optimizing the heat transfer characteristics of a heat exchanger to minimize total energy requirements.

Cooling arrangement and method for cooling of a heat source. The cooling arrangement includes a closed loop, a semi-open loop and at least one fan. The closed loop includes a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream the primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop includes a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

In one embodiment, a method includes delivering power and data on a cable from a central network device to a splitter device for splitting and transmitting the power and data to a plurality of remote communications devices over a plurality of cables, each of the cables carrying the power and data, receiving at the central network device, monitoring information from the remote communications devices on the cable, processing the monitoring information, and allocating the power and data to each of the remote communications devices based on the monitoring information. The power and data comprises pulsed power and optical data. A system is also disclosed herein.

A non-circular disconnect, comprising: a male body to insert into a non-circular female disconnect; a male poppet, wherein: when the non-circular disconnect is not inserted into the non-circular female disconnect, the male poppet is held in place, via spring force, at an opening of the non-circular male body to create a seal to prevent leakage; and when the non-circular disconnect is inserted into the non-circular female disconnect, the male poppet is pushed inwards, to allow for liquid to flow through the non-circular disconnect, by a plunger in the non-circular female disconnect.

A liquid-cooling termination structure having temperature sensing function is disposed on a liquid-cooling system which is used for performing a heat dissipating operation to a heat source of equipment. The liquid-cooling termination structure includes a water cooling head and a temperature sensing unit. The water cooling head is formed with an adhering surface used for being adhered on the heat source. The temperature sensing unit includes a sensing terminal, and a signal transferring cable extended from the sensing terminal. The sensing terminal is combined with the water cooling head from the exterior of the water cooling head, and the signal transferring cable is connected to the equipment for obtaining the temperature of the heat source through the water cooling head.

A server includes a chassis; a base panel fixedly coupled to the chassis; a movable panel coupled to the base panel; and a locking member fixedly coupled to the movable panel. The movable panel is movable relative to the base panel in a moving direction between an unlocked position where the locking member is configured to be disengaged with a locking panel of an electronic rack, and a locked position where the locking member is configured to be engaged with the locking panel of the electronic rack.

The invention describes a dual-circuit cooling system within a technical basin (1) in which high-performance computers or circuits (2) are supported on an intermediate floor (3). The intermediate floor (3) has feet (15) with a holder (20) for a heat exchanger (13).

The invention describes a device and a method for cooling one or several high-performance computers or circuits (2) preferably located in (a) housing(s) (11) and comprising a dual-circuit cooling system, wherein the high-performance computers or circuits (2) are dipped into an, in particular, dielectric first cooling liquid (17) in a preferably cuboid basin (1) with a completely fluid-tight design and a first cooling circuit with a pump (14) is arranged in the basin (1) for the circulation of the first cooling liquid (17), with the first cooling liquid (17) being forced to flow through the housings (11) of the high-performance computers or circuits (2) during circulation, thus cooling them.

In the basin (1), a heat exchanger (13), a forward flow (12) and a return flow (10) of a second cooling circuit with the second cooling liquid (21) are accommodated, wherein the heat exchanger (13) is dipped into the first cooling liquid (17) and the first liquid (17) is cooled by means of a second cooling liquid (21).

Embodiments disclosed include a heat exchange apparatus comprising an equipment-side coolant circuit configured for fluid communication with a first coolant compartment via a first coolant in-flow and out-flow valve. The embodiment further comprises a second coolant compartment operatively coupled to the first coolant compartment and comprising a second coolant in-flow and out-flow valve in fluid communication with a coolant supply source. The first coolant compartment is calibrated to receive hot coolant via the first coolant in-flow valve from a heat transfer element comprised in the equipment side coolant circuit line coupled to a heat generating source and in fluid communication with the first coolant in-flow valve, and the first coolant out-flow valve is calibrated to return the coolant to the heat transfer element comprised in the equipment side coolant circuit line. The second coolant compartment is calibrated to receive cold coolant from the coolant supply source via the second coolant in-flow valve and to return the received cold coolant to the coolant supply source via the second coolant out-flow valve in an open-loop coolant circuit line.