Methods, systems, and apparatuses for a power card for use in a vehicle. The power card includes an N lead frame, a P lead frame, and an O lead frame each having a body portion and a terminal portion. The O lead frame is located between the N lead frame and the P lead frame. The power card includes a first power device located between the N lead frame and the O lead frame, with a first side coupled to the body portion of the N lead frame and a second side coupled to the body portion of the O lead frame. The power card includes a second power device located between the O lead frame and the P lead frame, with a first side coupled to the body portion of the O lead frame and a second side coupled to the body portion of the P lead frame.

A converter comprises: a housing including an inner space; electronic components disposed in the inner space; a first pipe disposed on the outer surface of the housing and comprising a first-first pipe and a first-second pipe arranged in parallel to and spaced apart from each other; and a second pipe coupled at both ends thereof to the first-first pipe and the first-second pipe, respectively.

Thermal monitoring and analysis of conditions in a power electronic system include sensing of thermal parameters of interest, such as temperature and humidity in an enclosure housing power electronic components. The components are cooled by a liquid coolant flow from a chiller through chiller plates associated with the power electronic components. Air is circulated through the enclosure for heat rejection from the chiller plates. Based on the sensed parameters, factors such as relative humidity and dew point of the cooling air may be computed and evaluated to determine the potential for condensation. Alarms, notices, or recommendations may be output for regulation of the chiller to avoid condensation. The system may also provide for evaluation of installation errors, and degradation of performance over time.

Implementations of a semiconductor package may include one or more semiconductor die embedded in a substrate; at least three pin fin terminals coupled to the substrate; at least one signal lead connector and a fixture portion coupled to the substrate; and a coating directly coupled to all surfaces of the substrate exposed to a coolant during operation. The fixture portion may be configured to be fastened to a fixture in an immersion cooling enclosure that may include the coolant.

Implementations of a semiconductor package may include one or more semiconductor die directly coupled to only a direct leadframe attach (DLA) leadframe including two or more leads; and a coating covering the one or more semiconductor die and the DLA leadframe where when the semiconductor package is coupled into an immersion cooling enclosure, the coating may be in contact with a dielectric coolant while the two or more leads extend out of the immersion cooling enclosure.

This power conversion device includes: a semiconductor power module including a module busbar; a capacitor module including a capacitor element, a capacitor case formed in a bottomed tubular shape and storing the capacitor element with sealing resin interposed therebetween and a capacitor busbar having one end electrically connected to the capacitor element and another end extending outward from the capacitor case and electrically connected to the module busbar; and a power conversion device case formed in bottomed tubular shape and storing the semiconductor power module and the capacitor module. An outer surface of a bottom wall of the capacitor case and an inner surface of a bottom wall of the power conversion device case are thermally connected to each other. The capacitor module has a heat dissipation member located toward an opening side of the capacitor case relative to the capacitor element and thermally connected to the sealing resin.

A cooling unit includes a unit main body including a bottom portion, a peripheral wall portion rising from the peripheral edge of the bottom portion, and a sealing body for sealing an opening of the unit main body. The unit main body is joined to the sealing body through a plasticized region, and a void is formed at a position close to the unit main body with respect to a center of the plasticized region.

The invention is a power electronic system comprising at least one power electronic component implemented at least partly on at least one circuit board. The circuit boards are planar and circular or toroidal in shape with the center thereof comprising a circular opening having a diameter D cooperating with a hose for circulating a flow.

An electric drive system (100) used in an electric vehicle or a hybrid electric vehicle to drive the vehicle's wheels to rotate. The electric drive system (100) includes an electric motor (300). The electric motor (300) includes a housing in which a stator and a rotor are received. A transmission device (400) is operatively coupled to the electric motor (300); and an output shaft (500) is operatively coupled to the transmission device (400). The output shaft (500) extends from the transmission device (400) and is substantially parallel to the rotor's axis of the electric motor (300). The electric drive system (100) also includes an inverter (200) secured over the housing of the electric motor (300) such that the inverter is located between the output shaft (500) and the housing of the electric motor (300).

Provided is a circuit structure having a novel structure with which the dissipation of heat from a heat generating component can be more reliably promoted with a short heat transfer path. A circuit structure includes: a heat generating component; bus bars connected to connection portions of the heat generating component; an insulating base member configured to hold the heat generating component and the bus bars; and a coolant flow path provided inside the base member and through which a coolant flows, the bus bars being in thermal contact with the coolant flow path.