H05K7/20927

VEHICLE PROVIDED WITH TWO ELECTRIC MOTORS

A vehicle having: two front wheels; two rear wheels; two electric motors, which are connected to the two wheels of a same axle; and an electronic power converter to control both electric motors. The electronic power converter has: two groups of power modules; at least one capacitor, which is connected in parallel to a DC input; a container, which houses the two groups of power modules and the capacitor and is provided with a cup-shaped body provided with a lower wall; and a cooling system provided with a chamber, which is configured to be flown through by a cooling liquid. The chamber of the cooling system is delimited, on one side, by the lower wall of the cup-shaped body of the container and, on the other side, by a containing wall, which is arranged at a given distance from the lower wall.

COMPACT ELECTRONIC POWER CONVERTER TO CONTROL AT LEAST ONE ELECTRIC MOTOR OF A VEHICLE

An electronic power converter to control at least one electric motor of a vehicle and having at least one group of power modules, each designed to power with an alternating current one single phase of the electric motor; two lateral plates, which are arranged on opposite sides of the group so as to form a pile; a hydraulic circuit, which is configured to cause a cooling liquid to circulate inside the plates; and a clamping system, which applies a clamping force to the pile in order to keep the pile compressed and has elastic elements, which are deformed in order to apply a compression force of elastic origin to the pile.

POWER DEVICE AND COOLING PLATE

According to a first aspect there is disclosed an assembly comprising a power device and a cooling plate which overlies the power device for heat transfer therebetween. The power device comprises a plurality of power switching components including at least a first power switching component and a second power switching component; wherein each of the power switching components is configured to dissipate heat to the cooling plate. The cooling plate comprises a plurality of cooling zones overlying and aligned with the respective power switching components for heat transfer, including first and second cooling zones corresponding to the first and second power switching components; and a flow channel for a cooling flow, extending between an inlet and an outlet through each of the cooling zones; wherein a geometric parameter of the flow channel that at least partly determines heat transfer in a respective cooling zone differs between the first and second cooling zones for improved heat transfer in the first cooling zone relative to the second cooling zone. According to a second aspect, there is disclosed a method for cooling the plurality of power switching components in an assembly in accordance with the first aspect.

CAPACITOR MODULE, POWER CONVERSION DEVICE, AND MOTER ASSEMBLY INCLUDING SAME

The present disclosure provides a capacitor module including: a capacitor; a first housing having a hexahedron shape and having an inner space in which the capacitor is disposed, the first housing including a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a cooling plate coupled to the first housing so as to seal the cooling parts.

DOUBLE-SIDED COOLING COLD PLATES WITH OVERHANGING HEAT SINKS AND THROUGH BODY BUSBAR FOR HIGH-POWER DENSITY POWER ELECTRONICS

A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.

Power convertor
11516949 · 2022-11-29 · ·

A power converter (100) includes a power converter circuit (1), a cooler (2), and a cover member (3). The power converter circuit is configured to convert input electric power into DC power or AC power. The power converter circuit is placed on the cooler. The cooler is configured to cool the power converter. The power converter circuit is housed between the cooler and the cover member. The cooler (2) includes a main body (20), a coolant flow passage (21), and a coolant input/output portion (22). The coolant flow passage is formed inside the main body. A coolant is circulatable through the coolant flow passage. The coolant input/output portion is coupled to the coolant flow passage. The coolant input/output portion includes a coolant introduction pipe (22a) and a coolant discharge pipe (22b). The coolant introduction pipe introduces the coolant from outside the cooler. The coolant discharge pipe discharges the coolant to outside the cooler. The coolant input/output portion (22) is joined to the main body. The joined part (23) has a joining strength lower than a strength of the main body.

Immersion cooling systems and methods for electrical power components

A system includes a vessel, a cooling fluid in the vessel, and at least one power magnetics assembly in the vessel and immersed in the cooling fluid. The system further includes at least one heat sink having a surface in contact with the cooling fluid in the vessel and at least one power semiconductor device mounted on the at least one heat sink. The cooling fluid may be electrically insulating and the vessel may be sealed.

Isolated power converter and hydrogen production system

An isolated power converter and a hydrogen production system are provided. An electrical connection structure in the isolated power converter includes N secondary winding output bus bars, N rectifier circuit input bus bars, and a positive-negative bus bar, where N is greater than or equal to 1. A secondary winding may include M tapping points, and the secondary winding output bus bar and the rectifier circuit input bus bar that correspond to the secondary winding each include M copper bars that are insulated and stacked. The M tapping points of the secondary winding overlap the M copper bars of the secondary winding output bus bar at input ends of the M copper bars, respectively. The positive-negative bus bar includes two copper bars that are insulated and stacked.

METHOD FOR DETERMINING A TARGET VOLUMETRIC FLOW RATE FOR A COOLANT
20220373374 · 2022-11-24 ·

The invention relates to a method for determining a target volumetric flow rate (V) for a coolant that is conducted through a coolant path in order to cool a power converter, wherein: the temperature (T.sub.C) of a DC-link capacitor of the power converter and the temperature (T.sub.K) of the coolant are determined, and a value for the target volumetric flow rate (V) is determined on the basis of the temperature (T.sub.C) of the DC-link capacitor and the temperature (T.sub.K) of the coolant.

CONVERTER
20220377931 · 2022-11-24 · ·

A converter comprises: a housing comprising a refrigerant flow path; a printed circuit board disposed on top of the housing and on the upper surface of which an electronic component is disposed; and a cover disposed on top of the printed circuit board and which covers the upper surface of the electronic component, wherein a heat transfer layer filled with a thermal interface material is disposed on the upper surface of the housing or the lower surface of the cover overlapping the electronic component in the vertical direction.