A system for cooling a power component includes a first metal layer. A cooling layer having a first surface is in contact with a surface of the first metal layer. A second metal layer is included having a surface in contact with a second surface of the cooling layer opposite the first metal layer. The cooling layer is of a material different from that of the first metal layer and that of the second metal layer. A plurality of cooling features are embedded in the material of the cooling layer. The cooling channels are spaced apart from both the first metal layer and the second metal layer by the material of the cooling layer. An electrically conductive path connects the first metal plate to the second metal plate.

The power conversion apparatus includes a housing attached to a roof of a vehicle, a heat-receiving block, and one or more heat pipes. The housing has an opening on the top in the vertical direction, and accommodates electronic components. The electronic components are attached to a first main surface, which is one of the main surfaces of the heat-receiving block. The heat-receiving block is attached to the housing and closes the opening. The one or more heat pipes are attached to a second main surface, which is the other of the main surfaces of the heat-receiving block, extend in a direction away from the heat-receiving block, and accommodate refrigerant therein.

A heat exchanger assembly includes a heat exchanger and a power electronics module mounted to the heat exchanger. The power electronics module is thermally coupled to the heat exchanger at a heat sink interface. A thermal interface material is arranged between the heat sink interface and a surface of the heat exchanger and a gasket arranged between the heat sink interface and the surface of the heat exchanger.

A power electronics assembly includes one or more power electronics devices, and a heat exchanger to which the one or more power electronics devices are mounted. The heat exchanger includes one or more fluid pathways extending through the heat exchanger to transfer thermal energy from the one or more power electronics devices into a flow of fluid passing through the one or more fluid pathways. The flow of fluid is a flow of liquid refrigerant diverted from a condenser of a heating, ventilation, and air conditioning (HVAC) system. The one or more power electronics devices includes at least one power electronics device located on each opposing lateral side of the heat exchanger.

A power electronics assembly includes one or more power electronics devices, and a heat exchanger to which the one or more power electronics devices are mounted. The heat exchanger includes an inlet manifold and an outlet manifold, and one or more fluid pathways extending connecting the inlet manifold and the outlet manifold, the heat exchanger configured to transfer thermal energy from the one or more power electronics devices into a flow of fluid passing through the one or more fluid pathways. Thee one or more fluid pathways include one or more internal enhancements and channel configurations to enhance thermal energy transfer by promoting boiling of the flow of fluid and to reduce the pressure drop in the pathways under a two-phase flow condition. The flow of fluid is a flow of liquid refrigerant diverted from a condenser of a heating, ventilation, and air conditioning (HVAC) system.

A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.

A power electronics device comprises a power semiconductor, a first circuit board controllingly connected to the power semiconductor, a lead frame connecting the power semiconductor and the first circuit board. The power semiconductor is connected to at least one contacting region of the lead frame in such a way that heat can be transferred from the power semiconductor to the lead frame and can be conducted away from the lead frame by the power semiconductor The power electronics device further comprises a housing , which borders at least regions of a fluid reservoir accommodating a coolant fluid. The power semiconductor and the lead frame are arranged in the fluid reservoir and are configured to transfer heat to the coolant fluid.

Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.

A heat dissipation apparatus or an inverter, includes a main heat sink, an extra heat sink, and a heat conducting element, the main heat sink includes a main substrate and a main fin, one end of the main fin is connected to the main substrate, the extra heat sink is located at an end of the main fin farther from the main substrate, the extra heat sink is detachably connected to the main heat sink, and the heat conducting element extends from the main substrate to the extra heat sink, to transfer heat between the main substrate and the extra heat sink. In this application, the heat dissipation apparatus is designed as a split structure. A dual heat dissipation function of the main heat sink and the extra heat sink improves a heat dissipation capability of the heat dissipation apparatus, and improves heat dissipation efficiency.

Provided is a power conversion device that achieves both downsizing and improvement in cooling efficiency to have improved reliability. The power conversion device includes a power conversion circuit unit which converts DC power into AC power, a flow path including body for letting a refrigerant for cooling the power conversion circuit unit flow, a filter circuit unit which suppresses electric noise from a wire for transmitting the DC power, and a filter case portion which houses the filter circuit unit, where the filter case portion is formed integrally with the flow path including body, and a gap between the filter case portion and the filter circuit unit is filled with a first resin.