An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.

A component mounting machine, includes a mounting base provided in a component mounting machine main body and movable at least in the horizontal direction; a mounting/demounting tool, detachably mounted on the mounting base and movable in the up-down direction while holding a component; a tool moving mechanism configured to move the mounting/demounting tool in the up-down direction; a mounting base moving mechanism configured to move the mounting base at least in the horizontal direction; and a control device configured to perform a seating improvement process for applying a force in a predetermined direction, including the horizontal direction, to the mounting base on which the mounting/demounting tool is mounted after the mounting/demounting tool is mounted on the mounting base and before the mounting/demounting tool holds the component, by a moving operation different from a moving operation for holding the component on the mounting/demounting tool in the mounting base moving mechanism.

A work machine including a work head including a holding tool to pick up and hold a component, a rotating device to rotate the holding tool about an axis of the holding tool, a pivoting device to pivot the holding tool between a first attitude in which a distal end portion of the holding tool faces downward and a second attitude in which the distal end portion of the holding tool faces sideways; a moving device to move the work head; and a control device to control operation of the work head and the moving device, the control device including an operation control section to cause the holding tool to pivot from the first attitude to the second attitude, and to cause the holding tool to rotate from a holding angle that is a rotation angle when the component was picked up to a target angle.

A component mounting machine which deals with a component remaining on a nozzle of a mounting head includes a board conveyance device conveying a board to a predetermined position, a component supply device accommodating multiple components therein, a component mounting device on which a mounting head which picks up and holds a component by vacuum pumping of a suction nozzle is installed and which mounts a component which is taken out from the component supply device onto a board which is conveyed by the board conveyance device, and a control device controlling each of the devices. The component mounting device performs lowering of the component, releasing the component with respect to the suction nozzle of the mounting head, a first lifting of the component to a middle height, a component pickup performed at the height of the first lifting, and a second lifting after the component pickup.

A component mounting machine is provided with a suction nozzle including a nozzle suction surface, a camera acquiring nozzle imaged data of a tip end of the suction nozzle, and a control device determining the quality of a nozzle suction surface.

A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is elastically supported to be movable up and down with respect to the nozzle holder, a flange that is provided at a position that is offset from the central axis of the nozzle, and a second engaging section that is able to move the nozzle downward by engaging with the flange and pressing down the flange against the elastic force of a nozzle spring. The controller measures in advance the deviation amount of the tip position of the nozzle between before and after the second engaging section moves the nozzle downward and controls the mounting head so as to suck the component and mount the component on the board taking the deviation amount into account.

A component mounting robot system includes a component transfer robot which transfers a mounting component including a mounting portion to a base component's mounting position; and a jig which corrects the mounting portion's position of the mounting component transferred by the component transfer robot to mounting position, wherein the jig includes a guide portion which corrects the mounting portion's position of the mounting component to the mounting position, and wherein the component transfer robot includes a holding section which holds the mounting component so that a posture of the mounting component is changeable. In this configuration, it becomes possible to construct the component mounting robot system which can correct position of the mounting portion of the mounting component, by changing the posture of the body of the mounting component and guiding the mounting portion to the mounting position even in a case where the mounting component has a cylindrical shape.

In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.

The present disclosure provides a power module, a chip-embedded package module and a manufacturing method of the chip-embedded package module. The chip-embedded package module includes: a chip having a first surface and a second surface that are disposed oppositely; a first plastic member including a first cover portion and a first protrusion; and a second plastic member including a second cover portion and a second protrusion. A height difference discontinuous interface structure is formed between the top surface of the second protrusion and the second surface of the chip, which cuts off a passage for expansion of delamination at an edge position of the chip, thereby effectively suppressing generation of the delamination.

An electronic-component assembly system is provided in the invention. The electronic-component assembly system includes a gripping device, a light-source device, a photographing device, and an image-processing device. The gripping device grips an electronic component, wherein the electronic component includes at least one pin. The light-source device includes a light source and emits light of the light source. The photographing device senses the light and generates a plurality of first one-dimensional images corresponding to the pins at different rotation angles. The image-processing device is coupled to the photographing device to receive the plurality of first one-dimensional images. The image-processing device transforms the plurality of first one-dimensional images into a two-dimensional image, generates adjustment information according to the two-dimensional image, and provides adjustment information to the gripping device, wherein the gripping device adjusts the angle and position of the electronic component according to the adjustment information.