The measurement position determination device of the present disclosure is a measurement position determination device for determining a measurement position on a board, the measurement position being for measuring height of the board on which on which a component is mounted, and includes a measurement position determination section for acquiring one or more scheduled mounting positions of the component on the board at the time of measuring the board height and determining at least one of the acquired scheduled mounting positions as the measurement position of the board height.

The image including both of the component and the nozzle that is being lowered toward the component is captured. The target height at which the nozzle is stopped in the mounting process is controlled based on this image. This enables the target height at the time of lowering the nozzle toward the component to be controlled regardless of a flow rate of air sucked from the nozzle.

A component placing device has a configuration where a plurality of nozzle shafts are moved in turn to a plurality of stations including a component holding and placing station and a component detecting station by rotating a rotating object having the plurality of nozzle shafts, in which nozzles are installed, about a rotation axis. A configuration where a flow path switcher, which selectively connects a suction path of each of the nozzles to a positive pressure source and to a negative pressure source by movement of a spool, is disposed on an inside of a corresponding one of the nozzle shafts, and air for power to drive the spool is supplied to the rotating object via a manifold, in which a communication plug for power air that comes into contact with an exterior surface of the rotating object is provided, is adopted.

A component mounting machine which deals with a component remaining on a nozzle of a mounting head includes a board conveyance device conveying a board to a predetermined position, a component supply device accommodating multiple components therein, a component mounting device on which a mounting head which picks up and holds a component by vacuum pumping of a suction nozzle is installed and which mounts a component which is taken out from the component supply device onto a board which is conveyed by the board conveyance device, and a control device controlling each of the devices. The component mounting device performs lowering of the component, releasing the component with respect to the suction nozzle of the mounting head, a first lifting of the component to a middle height, a component pickup performed at the height of the first lifting, and a second lifting after the component pickup.

A mounting device is provided with a first raising and lowering drive section configured to raise and lower an entire syringe member to which a suction nozzle that picks up a component is attached, and a second raising and lowering drive section that raises and lowers the suction nozzle only of the syringe member to which the suction nozzle is attached. The mounting device controls a raising and lowering operation of the first raising and lowering drive section based on height information that includes at least one of information of the thickness of the component and information of the height of a board. With the mounting device, it is possible to move the entire syringe member to which the suction nozzle is attached to a position closer to the board in accordance with the height of the board and the thickness of the component.

An interference-prevention Q-axis rotation height position is set as a height position at an intermediate point of raising operation of suction nozzle, and a height position at which the component does not interfere with central protruding member on the lower surface of rotary head. Performed is control of large component interference prevention mode, in which, after picking up the component using suction nozzle at a component pickup height position that is the lower limit height position of lowering operation, the direction of the component is corrected by raising the suction nozzle to the interference-prevention Q-axis rotation height position that is a height position at an intermediate point of raising operation of suction nozzle and then rotating the component held by suction nozzle by Q-axis driving operation, and subsequently raising suction nozzle to a maximum height position of the raising operation, and then moving rotary head in the XY direction.

A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer.

A component delivery device includes an actuator that displaces an outer sleeve and an inner rod positioned within a cavity of the outer sleeve together from a retracted configuration to an extended configuration to move an ejectable component in relation to a feed head. The actuator further displaces the outer sleeve and not the inner rod to an ejection configuration to displace the ejectable component toward a workpiece. Displacing the outer sleeve and not the inner rod causes the outer sleeve to translate over the inner rod and compresses a biasing member that is disposed within the cavity and in engagement with the inner rod.

A component mounter including a mounting head having multiple holding bodies, a revolving mechanism configured to revolve the multiple holding bodies along a revolution trajectory, a rotating mechanism configured to cause the multiple holding bodies to rotate on their axes in synchronism with each other, a detection section configured to detect a component located in one or more component detection positions which are different from the component pickup positions on the revolution trajectory from a side thereof; and a control section. The control section performs component pickup processing for causing the mounting head to cause at least one of the holding bodies located in the component pickup position to pick up and hold the component and holding body revolving processing for causing the revolving mechanism to locate the holding body that does not hold the component.

An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.