The invention relates to a substrate (1) for electrical circuits comprising at least one first composite layer (2) which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer (3) and an aluminium layer (4) attached thereon, wherein at least the surface side of the aluminium layer (4) facing away from the copper layer (3) is anodized for the generation of an anodic or insulating layer (5) made of aluminium oxide, and wherein the anodic or insulating layer (5) made of aluminium oxide is connected to a metal layer (7) or at least one second composite layer (2) or at least one paper-ceramic layer (11) via at least one adhesive layer (6, 6).

A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).

Patterns of homogenous, electroless-plated metals within and on one or both sides of a porous substrate (such as nanocellulose sheets) enable the formation of an matrix of metal within pores of the substrate that can connect patterns on both sides of the substrate. These can serve as circuits with applications in, for example, wearable electronics.

A fabric coated with functional silicone rubber, the fabric being configured such that a coating layer may not be easily separated from the fabric and may be used to form a power line or a signal line. The fabric includes: a woven fabric made by weaving and including uniform pores therein; and a coating layer formed by coating a surface of the woven fabric with liquid silicone rubber in which electrically conductive particles larger than the pores of the woven fabric are dispersed and mixed, wherein the liquid silicone rubber permeates into the pores of the woven fabric by the weight thereof and is cured such that the silicone rubber is anchored to the woven fabric, and an electrically conductive layer having electrical conductivity is formed as the electrically conductive particles are caught on the surface of the woven fabric and increase in density at the surface of the woven fabric.

A wiring board includes: a support body including a plurality of openings passing from one surface to one other surface; and a conductor supported by the support body. The conductor includes: a first outer layer formed on one side of the support body; a second outer layer formed on the other surface of the support body and that has substantially the same shape as the first outer layer; and an inner layer formed inside the support body and that connects the first outer layer and the second outer layer. The inner layer has a frame shape along an outer edge of the first outer layer and along an outer edge of the second outer layer.

An electrical device including a plug connector. The plug connector includes a first flexible substrate having a plurality of signal contacts, the first flexible substrate extending from a terminating end to a mating end and configured to be flexible between the terminating end and mating end. A second flexible substrate extends in parallel spaced relation to the first flexible substrate to form a cavity between the first flexible substrate and second flexible substrate. The second flexible substrate having a plurality of signal contacts. The second flexible substrate extends from a terminating end to a mating end and configured to be flexible between the terminating end and mating end. The plug connector includes a rigid section disposed in the cavity at the mating end, the first flexible substrate moves in relation to the rigid section.

Devices and methods for encapsulating a portion of a wound dressing with biocompatible coating are disclosed. In some embodiments, a method includes coating a first side of a flexible wound contact layer of the wound dressing with a hydrophobic coating. The first side of the wound contact layer can support a plurality of electronic components. The method can further include coating a second side of the wound contact layer opposite the first side with the hydrophobic coating. The wound contact layer can be formed at least partially from hydrophilic material.

Provided herein is a method to printed electronics, and more particularly related to printed electronics on flexible, porous substrates. The method includes applying a coating compound comprising poly (4-vinylpyridine) (P4VP) and SU-8 dissolved in an organic alcohol solution to one or more surface of a flexible, porous substrate, curing the porous substrate at a temperature of at least 130 C. such that the porous substrate is coated with a layer of said coating compound, printing a jet of a transition metal salt catalyst solution onto one or more printing sides of the flexible, porous substrate to deposit a transition metal salt catalyst onto the one or more printing sides, and submerging the substrate in an electroless metal deposition solution to deposit the metal on the flexible, porous substrate, wherein the deposited metal induces the formation of one or more three-dimensional metal-fiber conductive structures within the flexible, porous substrate.

A sensor device may detect pressure. The sensor device may comprise: an elastic dielectric; a first wiring formed on one surface of the elastic dielectric; a second wiring formed on another surface of the elastic dielectric facing the surface on which the first wiring is formed; and a flexible printed circuit board, which is connected to the first wiring and the second wiring, for receiving signals transferred from the first wiring and the second wiring.

A ceramic and polymer composite including: a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity or a porous void space of from 50 to 15 vol %, based on the total volume of the composite; and a second continuous polymer phase situated in the porous void space of the sintered porous ceramic. Also disclosed is a composite article, a method of making the composite, and a method of using the composite.