A semiconductor device includes a circuit board including an insulating layer having opposite front and rear surfaces, an electrode pad disposed on the front surface, a housing having an installation area for the circuit board, and a bonding material embedded in a recess within either a first area located at the rear surface of the insulating layer directly below an area of the circuit board in which the electrode pad is disposed, or at a second area located within the installation area of the housing and corresponding to the first area in a plan view.

In one embodiment, an apparatus includes a plurality of layers in a circuit board, each of the layers comprising a fiber weave, two plated holes extending through the layers and connecting two or more of the layers, and a non-plated hole interposed between the plated holes. The non-plated hole passes through a potential CAF (Conductive Anodic Filament) migration path along the fiber weave to prevent CAF formation between the plated holes.

A printed circuit board (PCB) incorporates at least one damping layer or section. The at least one damping layer is incorporated in the PCB to absorb vibrations or oscillations that may be conveyed to the PCB. Such vibrations or oscillations may be generated by one or more electrical components coupled to the PCB. The damping layer is disposed to prevent the PCB from audibly vibrating when the electrical components associated with the PCB are caused to vibrate or pulsate under a voltage load.

A multilayer filter printed circuit board includes filtering material in one or more filter layers. The filtering material can include superconducting material, normal material, magnetic material and semi-conductor material. The multilayer filter printed circuit board may be used as part of a tubular filter structure. The filtering material may be dispersed in, or on the filter layers in a pattern or at random. The filter layers may have a first and second portion that are co-planar, and comprising different filtering materials from one another. The first and second portion may be electrically isolated from one another. Two or more filter layers may comprise different filtering materials from one another. Additional filter layers comprising filtering material may be formed outward of the outer electrically insulative layers.

The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Embodiments are generally directed to non-planar on-package via capacitor. An embodiment of an embedded capacitor includes a first plate that is formed in a package via; a dielectric layer that is applied on the first plate; and a second plate that is formed in a cavity in the dielectric layer, wherein the first plate and the second plate are non-planar plates.

Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.

A method of creating thermal boundaries in a substrate is provided. The method includes forming the substrate with first and second sections to be in direct thermal communication with first and second thermal elements, respectively, machining, in the substrate, first and second cavities for defining a third section of the substrate between the first and second sections and disposing a material having a characteristic thermal conductivity that is substantially less than that of the ceramic in the first and second cavities.

A conductor path structure has a damping device for an oscillation-damped and/or vibration-damped (electronic, electromechanical, micromechanical) component. The conductor path structure has a first base body made of a carrier material including a connection area for receiving the component. The connection area is arranged separated from an area of the first base body surrounding it and is arranged oscillation-damped and/or vibration damped and co-acting with an intrinsic damping device of the conductor path structure. The conductor path structure includes a second base body arranged at a distance under the first base body, wherein above the second base body of the conductor path structure at least one adhesive layer of a damping material is provided. The intrinsic damping device is formed by said at least one adhesive layer arranged between the connection area of the first base body and the area of the second base body arranged below the connection area.

A method of manufacturing a printed circuit board or a subassembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material,
wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties.

Furthermore a printed circuit board (10) or sub-assembly thereof is provided.