Disclosed are an inkjet print system and an inkjet printing method using the same. An inkjet print system according to one embodiment of the disclosure may include a stage on which a printing medium is loaded and which moves the printing medium in a first direction, an inkjet head which moves in a second direction perpendicular to the first direction and in which a plurality of nozzles configured to eject an ink on the printing medium are formed, a measurement instrument which moves in the second direction independent of the inkjet head and measures a height for each section of an impacted coating layer on the printing medium, and a processor which allows the nozzles to be opened or closed on the basis of height information of the coating layer.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.

A substrate with an antenna according to the present disclosure includes a circuit board having one main surface and the other main surface, and an antenna element mounted on the one main surface of the circuit board. When viewed from a thickness direction, an area of the one main surface of the circuit board is larger than an area of the other main surface, and the antenna element is mounted on at least a part of a region that is on the one main surface of the circuit board and that protrudes from the other main surface.

A ruggedized direct-view LED display system (100) includes a bonding matrix (215) that helps secure an array of LED chips (205) to a printed circuit board (PCB) (210). The bonding matrix may consist of an epoxy or other resin deposited on the surface (310) of the PCB after soldering the LED chips to the PCB. The bonding matrix has a thickness that is less than the thickness of the LED chips so that light-emitting outer portions (415) of the LED chips are not covered by the bonding matrix material. A method of forming the bonding matrix is also disclosed, including depositing bonding matrix material onto the PCB between the LED chips using nozzles or needles, optionally wicking excess bonding matrix material, and optionally degassing the bonding matrix material before curing it to form the bonding matrix.

A flexible wiring board that includes a flexible substrate; a flexible wiring over the flexible substrate; and a protective layer over the flexible substrate, where the protective layer includes: a first region that overlaps with the flexible wiring and a second region that does not overlap with the flexible wiring as viewed from a thickness direction of the flexible substrate, and a low flexibility part that is higher in flexibility ratio than the first region and is disposed along an extending direction of the flexible wiring in the second region.

In one embodiment, the substrate is configured for a semiconductor laser diode and comprises a plurality of substrate layers. The substrate layers include insulating layers and carrier layers, which are thicker. A plurality of electrical contact surfaces, which are configured for the semiconductor laser diode, a laser capacitor and a control chip, are located on an assembling side of a first, uppermost substrate layer, which is an insulating layer. Electrical conductor tracks, which electrically interconnect the contact surfaces, are located on the one hand between the first insulating layer and a second insulating layer, and on the other hand between the second insulating layer and a third substrate layer, which is preferably an insulating layer.

A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on an upper surface of the insulating layer; a first solder resist disposed on an upper surface of the insulating layer and having a height smaller than a height of the circuit pattern; and a second solder resist disposed on an upper surface of the first solder resist and including a first portion having an upper surface lower than an upper surface of the circuit pattern and a second. portion having an upper surface higher than the upper surface of the circuit pattern, wherein the circuit pattern includes: a plurality of first circuit patterns disposed on an upper surface of a first region of the insulating layer, and a plurality of second circuit patterns disposed on an upper surface of a second region of the insulating layer; wherein the first portion of the second solder resist is disposed between the plurality of first circuit patterns to have an upper surface lower than an upper surface of the first circuit pattern; and wherein the second portion of the second solder resist has an upper surface higher than an upper surface of the second circuit pattern, and is disposed to cover the plurality of second circuit patterns between the plurality of second circuit patterns.

A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.

A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: .Math.m) to an elastic modulus (unit: GPa) at 100° C. is 50 or more in the insulating layer, and the circuit layer has an elastic modulus at 100° C. of 100 GPa or less.