A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.

An assembly comprises a flexible circuit board (FCB) having a substrate with a top side, and a circuit pattern layer on the top side of the substrate. The circuit pattern layer has a connection region for facilitating electrical interconnection to the FCB, and one or more cavities extending through both the substrate and the circuit pattern layer. A first conductive layer for electro-magnetic interference (EMI) shielding is positioned on a top side of the FCB, and a second conductive layer for EMI shielding is positioned on a back side of the FCB. Electrically conductive adhesive extends through the one or more cavities for electrically connecting the first conductive layer and the second conductive layer. The electrically conductive adhesive further extends from the first conductive layer to the connection region for facilitating electrical interconnection of the first conductive layer and the second conductive layer.

A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a plurality of signal lines provided at positions not overlapping each other as viewed from a laminating direction of the insulating resin base material layers, and a ground conductor overlapping the plurality of the signal lines as viewed from the laminating direction. Openings are provided in the ground conductor and, as viewed from the laminating direction, an aperture ratio is higher in an inner zone that is sandwiched between two signal lines than in an outer zone of the two signal lines.

A module includes a substrate including a first main surface, a columnar conductor arranged on the first main surface, a first sealing resin that seals at least the columnar conductor and the first main surface while exposing a first end surface of the columnar conductor, a conductive film connected to the columnar conductor and arranged to extend laterally from the first end surface, a resin sheet arranged to cover at least the conductive film, a conductor via provided in the resin sheet and having one end connected to the conductive film, and a conductor pattern arranged on a surface of the resin sheet on a side far from the substrate to be connected to the other end of the conductor via and being larger in area than the first end surface.

The high frequency module includes a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The circuit component is mounted on the first main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers at least part of an outer peripheral surface of the circuit component. The shield layer covers at least part of the resin layer and a main surface of the circuit component that is far from the mounting substrate. The high frequency module has a gap at at least one of a position between the circuit component and the resin layer, a position between the circuit component and the shield layer, a position inside the resin layer, and a position inside the shield layer.

Systems, methods, and apparatus that employ a connector assembly having a substrate layer with an inner aperture and an outer periphery, and one or more signal traces disposed on the substrate that extend from an inner first location to an outer second location of the apparatus, for communicating data between electronic devices positioned within an interior volume of an enclosed vessel and complementary electronic devices positioned in an ambient environment external to the enclosed vessel. An inner connector is conductively connected the signal traces at the inner first location of each signal trace, and an outer connector is conductively connected to the one or more signal traces at the outer second location of each signal trace. A substantially flat exterior surface extends radially over at least a portion of a region between the respective first locations and the respective second locations.

An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents and shielding guest material. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.

Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.

A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.