An electrical connector including an insulating body, a plurality of terminals disposed in the insulating body, a first metallic shell enclosing the insulating body to form an interface for being plugged by another electrical connector, and a second metallic shell is provided. The first metallic shell has a first soldering leg close to the interface, and the second metallic shell encloses the first metallic shell, wherein the first soldering leg extends away from the insulating body, penetrates the second metallic shell and protrudes out of the second metallic shell.

A contact comprising: (a) a contact housing, said contact housing being narrower than a cavity of a connector such that said contact housing is laterally movable within said cavity; (b) an optical interface for receiving a ferrule of a mating connector contact; (c) optoelectrical circuitry optically connected to said optical interface, wherein said optical interface and said optoelectrical circuitry are held rigidly in relation to each other within said contact housing; and (d) an electrical interface electrically connected to said optoelectrical circuitry and configured for electrical connection to a circuit board, wherein said electrical interface comprising at least a flexible cable to provide compliance between said optoelectrical circuitry and said circuit board.

The present invention provides a novel method of constructing a coax spring-pin socket that furnishes better performance and is easier to manufacture in volume using common dielectrics and copper plating. This is accomplished by, in application, a lamination of PCB dielectric layers. This dielectric block is then drilled, plated, etched, and drilled in steps for the construction of a coaxial structure for the signal pins, and a ground structure for ground pins. This design process that can be quickly adjusted and customized for each design.

Disclosed is a motherboard comprising at least one printed circuit board (PCB), referred to as the motherboard PCB, at least one planar transformer, which is mounted on the motherboard PCB, and a plurality of electronic components, which are also mounted on the motherboard PCB. The planar transformer comprises at least one printed circuit board with windings and a connection interface, a magnetic core arranged on the printed circuit board so as to interact with the windings, and at least one electronic component mounted on the printed circuit board.

What is provided is an adapter plate for HF structures, which is set up for being disposed between a back of a circuit board and a reflector, wherein the adapter plate is electrically conductive, and the adapter plate has an opening or a cavity at every location where an element is passed through the circuit board to the side of the adapter plate, wherein at least one element is passed through the circuit board exclusively for ground contacting.

A substrate structure including a carrier and a substrate is provided. The carrier includes a release layer, a dielectric layer and a metal layer. The dielectric layer is disposed between the release layer and the metal layer. The substrate includes a packaging region and a peripheral region. The peripheral region is connected to the packaging region and surrounds the packaging region. The peripheral region or the packaging region has a plurality of through holes. The substrate is disposed on the carrier. The release layer is located between the substrate and the dielectric layer. The release layer and the dielectric layer are filled in the through hole such that the substrate is separably attached to the carrier.

The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

There are provided an electronic device mounting board and an electronic apparatus that can be made lower in profile. An electronic device mounting board includes an insulating substrate having an opening in which an electronic device is disposed so as to lie over the opening as seen in a transparent plan view, and a reinforcement portion disposed on a surface or in an interior of the insulating substrate so as to lie around the opening of the insulating substrate as seen in a transparent plan view.

A camera module is provided, including a lens driving mechanism, a lens unit, a circuit board, and an image sensor. The lens unit is disposed on the lens driving mechanism. The image sensor is disposed on the circuit board. The circuit board includes a metal member, an insulation layer, and a metal wire. The insulation layer is disposed between the metal member and the metal wire, and the metal wire is electrically connected to the image sensor. The lens driving module can drive the lens unit to move relative to the image sensor. The image sensor can catch the light through the lens unit.

A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.