A manufacturing method of a circuit board and a stamp are provided. The method includes the following steps. A circuit pattern and a dielectric layer covering the circuit pattern are formed on a dielectric substrate. A conductive via connected to the circuit pattern is formed in the dielectric layer. A photoresist material layer is formed on the dielectric layer. An imprinting process is performed on the photoresist material layer using a stamp to form a patterned photoresist layer, wherein the pressing side of the stamp facing the circuit pattern becomes sticky when subjected to pressure so as to catch photoresist residue from the photoresist material layer in the imprinting process. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed.

A circuit carrier includes a first side, two layers arranged to define an intermediate space there between, with at least one of the two layers being electrically conductive and attached to the first side. The at least one of the two layers has a region deformed such as to exhibit an indentation and has a trace structure in the indentation. A first insulating material fills the intermediate space, and a second insulating material fills the indentation, A second side in opposition to the first side is shaped to have in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.

An electrical element includes a pair of conducting elements spaced from one another, a recess receiving an electrical component, and a trough extending from a first conducting element of the pair of conducting elements to a second conducting element of the pair of conducting elements. The conducting elements are at least partially exposed in the recess.

A first unit (100) including a first member (110) of a releasable fastening arrangement (300) is presented. The releasable fastening arrangement (300) is arranged to provide a mechanical connection of the first unit (100) to a second unit (200), and an electrical connection of a first electrical circuit (120) included in the first unit (100) to a second electrical circuit (220) included in the second unit (200), when a male profile (115) of the first member (110) is inserted into a corresponding female profile (215) included in a second member (210) of the second unit (200). The mechanical connection is provided based on a material deformation of the male profile (115). The electrical connection is provided by contact between one or more first flexible conductors (124) arranged on a first flexible and electrically insulating layer (126) of the first electrical circuit (120) and one or more second flexible conductors (224) arranged on a second flexible and electrically insulating layer (226) of the second electrical circuit (220).

A resin multilayer substrate includes a stacked body provided by stacking and thermocompression bonding resin layers, a first conductor pattern inside the stacked body, and a first protective coating covering at least a first surface and a side surface of the first conductor pattern. The resin layers are made of a first thermoplastic resin, and the first protective coating is made of a second thermoplastic resin. Both of the first and second thermoplastic resins soften at a predetermined press temperature or less. The second thermoplastic resin has a storage modulus lower than a storage modulus of the first thermoplastic resin at a temperature equal to or less than the predetermined press temperature and equal to or more than room temperature.

A circuit carrier includes a first side, two layers arranged to define an intermediate space there between, with at least one of the two layers being electrically conductive and attached to the first side. The at least one of the two layers has a region deformed such as to exhibit an indentation and has a trace structure in the indentation. A first insulating material fills the intermediate space, and a second insulating material fills the indentation, A second side in opposition to the first side is shaped to have in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.

A method for manufacturing a ceramic substrate that includes preparing a plurality of ceramic green sheets, at least one of the plurality of ceramic green sheets having a disappearance material that disappears by firing in a recessed portion formation planned region of the at least one of the plurality of ceramic green sheets; forming a mother multilayer body by laminating the plurality of ceramic green sheets such that the at least the one ceramic green sheet having the disappearance material is positioned on an uppermost layer of the mother multilayer body; and forming a recessed portion in the mother multilayer body before firing by pressing the recessed portion formation planned region of the mother multilayer body.

Realized is a multilayer substrate and a multilayer substrate array, each of which has a high degree of freedom in a production method. At least part of an outer periphery (51) of a multilayer substrate (100), which includes a wiring provided on an inner layer, is processed so as to have a wave shape.

Disclosed herein is a multi-planar circuit board, as well as related structures and methods. In an embodiment, a circuit board may include a first surface, a first section having the first surface in a first plane, a second section having the first surface in a second plane, and a third section connecting the first and second sections, where the third section defines a gradient between the first and second planes, and where all sections are sections within a contiguous board. In another embodiment, circuit board may further include a first component having a first thickness coupled on the first face of the first section, and a second component having a second thickness, greater than the first component, coupled on the first face of the second section, where the second section is in a lower plane, and where the overall thickness is the circuit board thickness plus the second thickness.

A coupling structure in a wiring board including a printed wiring board and a flexible printed wiring board overlaid on the printed wiring board. The printed wiring board includes a first conductive line on a surface adjacent to the flexible printed wiring board. The flexible printed wiring board includes a second conductive line on a surface on an opposite side from the printed wiring board. The flexible printed wiring board includes a conduction-purpose through hole adjacent to the second conductive line and in which a section of the first conductive line is disposed. The first conductive line of the printed wiring board and the second conductive line of the flexible wiring board are electrically connected to each other with a conductive member disposed in the conduction-purpose through hole. The conductive member is covered with a resin having an insulating property.