A multi-layer substrate structure which can be peeled off precisely includes: a substrate; a first flexible dielectric layer formed on the substrate; a peel-off layer formed on the first flexible dielectric layer; and a unit to be peeled off formed on the peel-off layer; wherein an adhesive force between the peel-off layer and the first flexible dielectric layer is smaller than an adhesive force between the first flexible dielectric layer and the substrate, and the substrate, the first flexible dielectric layer, the peel-off layer, and the unit to be peeled off together form the multi-layer substrate structure. A method for manufacturing a multi-layer substrate structure which can be peeled off precisely is also provided.

A semi-flex component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. The at least one electrically insulating layer structure forms at least part of the semi-flexible portion and includes a material having an elongation of larger than 3% and a Young modulus of less than 5 GPa.

A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion, and a component embedded in the at least one rigid portion. The at least one electrically insulating layer structure of the stack has a mechanical buffer structure surrounding at least part of the component and has a lower value of the Young modulus than other electrically insulating material of the stack.

In example implementations, a system board is provided. The system board includes a printed circuit board and an extended portion. The printed circuit board includes an electrical connection to a processor of a computing system. The extended portion is to redistribute power. The extended portion includes a connection to connect to a power supply unit and a plurality of power connections. The plurality of power connections are located along an edge of the extended portion to connect wiring to other components within the computing system and deliver power from the power supply unit to the other components.

A flexible electronic circuit includes a plurality of leaves having a proximal section, a distal section, and an intermediate section. The plurality of leaves are bonded to each other within the distal section and loose within the intermediate section. The intermediate section also includes conductive connector pads for a wiring harness. A plurality of test connector pads are disposed on the plurality of leaves within the proximal section. The leaves within the proximal section may also be bonded to each other, for example in a ribbon or stepped configuration, in order to facilitate connection to testing apparatus. Once the circuit is tested, the proximal section can be severed from the intermediate section prior to installation of the circuit into a medical device, such as an intracardiac echocardiography catheter.

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

An electronic assembly and a manufacturing method thereof are provided. The electronic assembly includes a carrier substrate including a flexible structure and a circuit structure, and an electronic device disposed on the circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern overlying thereon. The circuit structure includes a second dielectric layer overlying the first dielectric layer and the conductive pattern, and a circuit layer disposed on and passing through the second dielectric layer to be in contact with the conductive pattern, the first flexible structure includes a first portion embedded in the circuit structure and a second portion connected to the first portion and extending out from an edge of the circuit structure. The electronic device includes chip packages electrically coupled to the flexible structure through the circuit structure, and is sized to substantially match a size of the first portion of the circuit structure.

A method of manufacturing a component carrier includes providing a stack with electrically conductive layer structures and at least one electrically insulating layer structure, embedding a magnetic inlay in the stack, and forming an electrically conductive coil structure at least partially based on the electrically conductive layer structures and surrounding at least part of the magnetic inlay.

An electronic device includes a casing, a main circuit board, a detachable component and a flexible circuit board. The main circuit board is disposed in the casing. The main circuit board includes a processor and a memory, wherein the memory stores data. The detachable component is disposed in the casing. The flexible circuit board includes a first end portion, a second end portion, a middle portion and a first detection loop, wherein the first detection loop is disposed at the first end portion and the middle portion. The first end portion is electrically connected to the main circuit board and the second end portion is fixed on the detachable component. When the detachable component is detached from the casing, the middle portion breaks, such that the first detection loop is cut off. When the first detection loop is cut off, the processor erases the data stored in the memory.