A circuit carrier and a manufacturing method thereof are provided. The circuit carrier includes at least one flexible structure and a circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern disposed thereon. The circuit structure is disposed on the flexible structure and electrically connected to the conductive pattern. The circuit structure includes a second dielectric layer and a circuit layer. The second dielectric layer is disposed on the flexible structure and has a Young's modulus different from that of the first dielectric layer. The circuit layer is disposed on and extends into the second dielectric layer to be in contact with the conductive pattern of the flexible structure. The flexible structure is interposed in the circuit structure. A portion of the first dielectric layer and a portion of the conductive pattern of the flexible structure are extended out from an edge of the circuit structure.

An electrical connection box includes: a box main body; an electric circuit body loaded into the box main body; a grounding member provided in the electric circuit body; a belt-like grounding metal plate extending from the grounding member to the outside of the box main body; a fixing bracket extending integrally with the box main body and including the grounding metal plate; and a bolt through hole formed through a tip end portion of the fixing bracket to electrically connect the grounding metal plate to a bolt to be inserted.

A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.

A protective film of a conductive adhesive, a circuit board and a method for assembling a display device are provided. The protective film of conductive adhesive includes: a basic material layer; and a photoinduced peelable adhesive and a protective layer which are arranged on a first surface of the basic material layer in sequence, and the photoinduced peelable adhesive has a low adhesive force in the exposure of light with a first wavelength. The protective film further includes a light-shielding film located on a second surface of the basic material layer opposite to the first surface.

A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.

A method for manufacturing a wiring board includes forming on a first support plate a first laminated wiring portion including conductor and insulating layers such that the first portion has a first surface on first support plate side and a second surface, separating the first portion from the first plate, forming a conductor layer exposed on the first surface and including pads, laminating the first portion on a second support plate such that the second surface of the first portion faces second support plate side, forming on the first surface of the first portion a second laminated wiring portion including conductor and insulating layers such that the second portion has a third surface on second support plate side and a fourth surface, forming cavity in the second portion on the second plate such that the cavity exposes the pads, and separating the first and second portions from the second plate.

A component carrier with a rigid portion, a flexible portion, a cavity defining the flexible portion next to the rigid portion, and at least one step in a transition portion between the rigid portion and the flexible portion in the cavity is disclosed.

A driver IC film unit including a flexible film, a driver IC on a first surface of the flexible film and configured to receive an input signal and convert the input signal into an image signal for a display panel, at least first to third pad units, on the first surface of the flexible film, configured to electrically connect the driver IC and the flexible film, and at least first to third wire units, on the first surface of the flexible film, electrically connected to the at least first to third pad units, wherein at least one wire unit among the at least first to third wire units is configured to be extended to a second surface facing the first surface via a first via hole passing through the flexible film, and is configured to include a cut portion of wire corresponding to an edge of the flexible film.

Method for producing a conductor structural element with a layer sequence having an internal layer substrate, including the steps: providing a rigid carrier having an underside and a top side; defining a cut-out section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the cut-out section is exposed; placing an internal layer substrate above the cut-out section with formation of a cavity between the rigid carrier and the internal layer substrate; aligning and fixing the internal layer substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the internal layer substrate with the cavity being left free; producing a cut-out by cutting the cut-out section out of the rigid carrier from the outer underside of the rigid carrier.