A circuit board includes a protective film of such a type that a mating contact slides on the protective film and rides over a pad, and is prevented from deteriorating due to attachment and detachment. A circuit board 10 includes a plate-shaped base body 40, a pad 20 formed on a surface of the base body 40 and responsible for electrical contact with a mating contact, and a protective film 30 that spreads on the surface of the base body 40 in contact with an edge of the pad 20. The edge of the pad 20 and a portion, which contacts the edge of the pad 20, of the protective film 30 respectively have heights consecutive to each other. The pad 20 contacts, by causing the mating contact that has slid in a sliding direction in contact with the protective film 30 to ride over the pad 20, the mating contact that has ridden over the pad 20.

A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle θ formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.

A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.

An electronic device includes at least two boards and support pillars. The at least two boards include hole portions. The support pillars inserted into the hole portions such that the at least two boards are held mutually separated. The hole portions include tapered surfaces that incline toward center portions of the hole portions from a surface on a side from which the support pillars of the boards are inserted.

Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.

A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.

One embodiment provides a circuit board having a substrate and an electrode portion which is provided on the substrate. The electrode portion includes: a quadrangular land which is provided on a front surface of the substrate; a solder layer which is laminated on the whole of a front surface of the land; and a pad which is joined to a front surface of the solder layer. When the electrode portion is seen from thereabove, an outer circumferential line of the pad touches each of four sides of the land. Exposed portions where the solder layer is exposed are formed individually at four corners of a front surface of the electrode portion. And, the exposed portions are formed to have the same shape.

A method of etching an electrically conductive layer structure during manufacturing a component carrier is provided. The method includes carrying out a first etching of at least one exposed region of an electrically conductive layer structure by a first etching composition having a photo-hardenable compound to thereby form a recess in the electrically conductive layer structure, hardening the photo-hardenable compound by irradiation with photons selectively on an upper side wall portion of the recess to thereby cover the upper side wall portion with a photo-hardened compound, carrying out a second etching by a second etching composition selectively on a side wall portion and/or bottom portion of the recess being not covered with the photo-hardened compound, and subsequently removing the photo-hardened compound from the side wall portion. In addition, a component carrier is provided.

A bonded substrate includes a substrate, a metal plate forming a stacked state with the substrate, and bonding member. The metal plate has a first surface on the substrate side and a second surface opposite; wherein an edge of the first surface is located outside an edge of the second. The bonding member is disposed between the substrate and plate to bond the plate and substrate, and protrudes from the edge over an entire periphery of the plate. In cut surfaces obtained by cutting the bonded substrate, a peripheral surface length (A) from a portion corresponding to a peripheral edge of the first surface to a corresponding portion of the second, protrusion length of the bonding member, and thickness (C) of the metal plate satisfy first and second expressions.
0.032≤B/(A+B)≤0.400  (First Expression)
0.5(mm)≤C≤2.0(mm)  (Second Expression)

An opto-electric hybrid board includes an electric circuit board in which electric wiring is formed on a front surface of an insulating layer, and an optical waveguide formed on the rear side of the electric circuit board. The optical waveguide and the electric circuit board are arranged so that left and right edges of the electric circuit board along a longitudinal direction of the optical waveguide overlap with left and right edges of the optical waveguide when viewed from above, or so that the left and right edges of the electric circuit board are on the inside of where the left and right edges of the optical waveguide are located. The opto-electric hybrid board is easy to handle owing to the reduced chance of the electric circuit board being damaged. The opto-electric hybrid board also does not cause misalignment of a core when used as a connector.