An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.

Provided is an electronic component mounting structure and method for mounting electronic components on the side of a printed circuit board by means of simple fabrication and enlarging the surface area for mounting electronic components. A cut face of a conductive plating layer, which is obtained by cutting along a via in which a conductive plating layer covering an inner wall face of a via hole is electrically connected to a conductive pattern layer of the printed circuit board, is exposed at a cut end face and used as a land pattern which is solder-connected to a mount connecting portion of the electronic component. The end face at which the land pattern is exposed is a surface parallel to the side of the printed circuit board, and therefore electronic components can be mounted on the end face parallel to the side.

An adhesion between a sealing resin layer and a shield film is improved by a mesh sheet disposed on an opposite surface of the sealing resin layer. A radio frequency module includes a wiring board, a component mounted on an upper surface of the wiring board, a sealing resin layer that covers the component, a mesh sheet disposed on an upper surface of the sealing resin layer, and a shield film provided to cover the upper surface and side surfaces of the sealing resin layer, and the mesh sheet. The mesh sheet and the sealing resin layer, as well as the mesh sheet and the shield film are firmly in adhesion with one another. Thus, the adhesion between the sealing resin layer and the shield film can be improved.

An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.

Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

A board element for board-to-board interconnect formation is provided. An embodiment includes embedding a signal via element in the board element and cutting through respective sections of the board element and the signal via element to expose a new board element edge and an outwardly facing surface of the signal via element.

A display device includes: a display panel including a first substrate including a thin film transistor, a second substrate facing the first substrate and a wiring layer disposed on the first substrate; and a flexible circuit board disposed on a first lateral side of the display panel, wherein the first lateral side of the display panel includes a recess portion, the wiring layer is exposed in the recess portion on the first lateral side, the flexible circuit board includes a conductive pad, and the conductive pad contacts the wiring layer in the recess portion to electrically connect the flexible circuit board and the wiring layer. The recess portion includes a first recess disposed on the first substrate.

A circuit carrier and a manufacturing method thereof are provided. The circuit carrier for coupling an electronic device includes a flexible structure and a circuit structure. The flexible structure includes a conductive pattern disposed on a surface of a first dielectric layer. The circuit structure includes a second dielectric layer overlying the surface of the first dielectric layer and a circuit layer disposed on the second dielectric layer and connected to the conductive pattern, The flexible structure is embedded in and electrically connected to the circuit structure, and a portion of the flexible structure extends out from an edge of the circuit structure to be plugged into the electronic device.

Devices and method related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

A printed circuit board includes a first transmission line provided on an insulating base, a first ground conductor, a notch portion that exposes a part of the first ground conductor, a conductor provided in the notch portion and electrically connected to the first ground conductor, and a first electrode exposed on a main surface of the insulating base facing a flexible board and electrically connected to the first transmission line. The flexible board includes a second transmission line provided on an insulating sheet, a second ground conductor, a second electrode exposed on a main surface of the insulating sheet facing the printed circuit board and connected to the second transmission line, and a third electrode exposed on the main surface of the insulating sheet and connected to the second ground conductor. The conductor and the third electrode are connected by solder.