A battery circuit board includes a substrate, a first trace configured to receive a voltage and forming a first closed loop around a perimeter of the substrate, and a second trace forming a second closed loop around the perimeter of the substrate. The battery circuit board also includes an electrical assembly configured to determine a presence of an electrolyte on the battery circuit board in response to a short circuit between the first closed loop of the first trace and the second closed loop of the second trace.

A hearing device has a printed circuit board on which a battery module is fastened. The battery module has a battery cell with a case, an antenna being integrated into the case. The hearing device further has a printed circuit board, on which a battery module is fastened. In particular, the printed circuit board is configured to be rigid, and is manufactured from a glass fiber-reinforced epoxy resin.

A nondestructive method generates a representation of a pattern of electrically conductive material on at least one layer of a multiple-layer printed circuit board (PCB). The method generates a plurality of imaging slices by evaluating the voxels in a 3D nondestructive data set to identify voxels having intensities representing electrically conductive material. The method establishes a reference plane that includes at least one voxel identified in a selected one of the plurality of slices. The method determines a distance of other voxels from the reference plane and adjusts the respective 3D coordinate of each other voxel to effectively position a respective adjusted voxel in the reference plane. The method generates a two-dimensional (2D) image that includes the at least one voxel and the adjusted voxels in the reference plane. The 2D image represents the pattern of electrically conductive material in the at least one layer.

The invention is an adapter enabling the interchange of the use of Integrated Circuit components on a Printed Circuit Board with a dissimilar Surface Mount Device footprint with minimal impact to total component height and no obstruction of typical optical inspection methods. The invention indirectly resolves common constraints of electronic circuit designs, such as IC obsolescence, market availability, and design improvements without discarding existing materials.

A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.

A circuit structure includes a low-density conductive structure, a high-density conductive structure and a plurality of traces. The high-density conductive structure is disposed over the low-density conductive structure, and defines an opening extending from a top surface of the high-density conductive structure to a bottom surface of the high-density conductive structure. The opening exposes a first pad of the low-density conductive structure and a second pad of the low-density conductive structure. The second pad is spaced apart from the first pad. The traces extend from the top surface of the high-density conductive structure into the opening. The traces include a first trace connecting to the first pad of the low-density conductive structure and a second trace connecting to the second pad of the low-density conductive structure.