An electronic device and an electronic circuit board thereof is disclosed. In the electronic circuit board an insulation substrate is provided with conductive pads, first conductive vias, second conductive vias, third conductive vias, first conductive traces, second conductive traces, and third conductive traces. The conductive pads are arranged in two rows. Each row includes biasing pads and signal pads. The second conductive vias and the third conductive vias are respectively arranged inside and outside the first conductive vias. Each of the signal pads arranged in a row nearest the second conductive vias electrically connects with one second conductive via through a first conductive trace. Each of the signal pads arranged in a row nearest the third conductive vias electrically connects with one third conductive via through a second conductive trace. The third conductive traces embedded in the insulation substrate are extended to positions vertically under the signal pads.

The present application discloses a method for fabricating ceramic insulator for electronic packaging, and relates to a technical field of outer shell packaging of electronic devices. Under the circumstance of using neither a chemical coating nor any bonding wire connection circuit, through a design that builds a electroplated circuit into the ceramic insulator, the method accomplishes coating of a nickel alloy protection layer onto a porcelain by an electroplating method, so that not only quality of a coating layer but also requirement of a complete appearance can be ensured. All circuits of the ceramic insulator fabricated by the aforesaid method can conduct with external circuits, such that the electroplating method can be used to accomplish coating of the nickel alloy layer, after accomplishment of all metal coating, metallization parts on an end surface of the porcelain is removed.

A semiconductor device according to an embodiment has a first semiconductor component and a second semiconductor component which are electrically connected with each other via an interposer. The interposer has a plurality of first signal wiring paths, and a plurality of second signal wiring paths each having a path distance smaller than each of the plurality of first signal wiring paths. Furthermore, the first semiconductor component includes a first electrode, a second electrode, and a third electrode arranged in order in a first direction. Furthermore, the second semiconductor component includes a fourth electrode, a fifth electrode, and a sixth electrode arranged in order in the first direction. Furthermore, the first electrode is connected with the fourth electrode via the first signal wiring path, the second electrode is connected with the fifth electrode via the first signal wiring path, and the third electrode is connected with the sixth electrode via the first signal wiring path.

An electronic component (11) is embedded in an end portion of a surface (P1) and an end portion of a surface (P2) adjacent to each other in a three-dimensional base (2). The portion of an electrode (21) exposed from the surface (P1) and an electrode (101) of a packaged IC (41) are connected to each other via a wiring line (201). The portion of the electrode (21) exposed from the surface (P2) and an electrode (25) of an electronic component (15) are connected to each other via a wiring line (202). Accordingly, it is possible to realize a three-dimensional circuit structure requiring no wiring line spanning over or along an end portion thereof.

A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.

A terminal, in which terminal conductors are disposed, is preliminarily formed on one surface of a substrate. Electrode conductors including covered lead wires are disposed in a region on the one surface of the substrate that does not overlap the terminal, the electrode conductors being bonded to the substrate by an adhesive material to form a predetermined conductor pattern, whereby a sensor pattern is disposed on the substrate. The lead wires of the electrode conductors are exposed due to the covering being removed at ends of the covered lead wires, the exposed lead wires are disposed while being aligned with and connectable to the corresponding terminal conductors of the terminal. The terminal conductors of the terminal and respective exposed lead wires of the electrode conductors of the sensor pattern are then electrically connected.

A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.

A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.

A flexible printed circuit board with multiple layers includes an inner wiring substrate and at least one outer wiring plate. Each outer wiring plate is connected to one surface of the inner wiring substrate, and defines at least one through hole which passes through the outer wiring plate to expose the inner wiring substrate. Each outer wiring plate further includes an adhesive plate connected to the inner wiring substrate. The adhesive plate includes a stepped portion extending towards a center of the through hole.

A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.