A component carrier with a stack including a first core layer structure and a second core layer structure, and a recess extending completely through the first core layer structure and extending at least partially into the second core layer structure. Each core layer structure has at least one electrically conductive layer structure and at least one electrically insulating layer structure. The core layer structures are stacked with one on top of the other in a stacking direction.

A display apparatus includes a display panel having a display substrate on which a plurality of pad terminals is disposed, and a driving unit having a plurality of driving terminals electrically connected to the plurality of pad terminals. Each of the plurality of pad terminals includes a stepped groove that faces a corresponding driving terminal of the plurality of driving terminals or each of the plurality of pad terminals includes an opening hole that faces the corresponding driving terminal of the plurality of driving terminals.

A flexible light emitting diode (LED) circuit having a first layer, the first layer including a conductive material configured to connect to an LED die, a second layer, the second layer including an electrically insulating material, and a third layer positioned between the first and second layer, the third layer having a first terminal extended electrically connecting tab that extends outward beyond the first layer and the second layer.

A printed circuit body includes a bus bar as a metal member electrically connected with a connected body, an insulator layer providing insulation properties, and a conductor layer formed across the metal member and the insulator layer and electrically connected with the metal member. The metal member and the insulator layer are positioned such that a metal-member side connected surface of the metal member on which the conductor layer is provided and an insulator-layer side connected surface of the insulator layer on which the conductor layer is provided are positioned at an identical plane. This configuration allows connection between the bus bar and the conductor layer and circuit formation to be simultaneously achieved at manufacturing of the printed circuit body, thereby facilitating formation of a wiring structure of the bus bar and the conductor layer.

A printed circuit board is provided. The board includes a plurality of vias through the printed circuit board, each having a first section with a first width, a second section with a second width less than the first width, and a third section with a third width greater than the second width and less than the first width. The second section is located between the first section and the third section, the first and second sections are plated, and the third section lacks plating. At least one of the plurality of vias has the first width dimensioned to receive a connector pin inserted through the first face. A further at least one of the plurality of vias has the first width dimensioned to receive a further connector pin inserted through the second face. Further versions of the printed circuit board and method of making a printed circuit board are provided.

A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

A board includes: a signal layer; a first layer and a second layer disposed so as to interpose the signal layer; a connector shell portion embedded on a first surface side of the board; a first solder joint portion that brings the connector shell portion and the first layer to be electrically conductive with each other; a contact portion disposed in a state where a center axis line of the contact portion coincides with a center axis line of the connector shell portion and the contact portion is electrically conductive with the signal layer; and an insulating portion disposed around the contact portion.

A method of manufacture of a circuit board without annular through-hole rings and thus allowing a higher component density includes a base layer, a first wire pattern layer, and a second wire pattern layer on both sides of the base layer. A portion of the base layer not covered by the first wire pattern layer defines at least one first hole. The circuit board further includes a wire layer. The wire layer includes at least a first portion and a second portion connecting to the first portion. The first portion is filled in the first hole. The second portion is formed on the first portion extending away from the base layer. A diameter of the second portion is less than an aperture diameter of the first hole. The wire layer is electrically conductive between the first wire pattern layer and the second wire pattern layer through the first portion.

A multilayer substrate includes a plurality of insulator layers laminated, a column conductor extending through two or more insulator layers among the plurality of insulator layers. The column conductor includes a first via conductor extending through a first insulator layer and a second via conductor extending through a second insulator layer adjacent to the first insulator layer. Each of the first via conductor and the second via conductor has a tapered shape in which a cross section decreases from one end portion to the other end portion in the lamination direction of the plurality of insulator layers. The first via conductor and the second via conductor are directly bonded to each other at large diameter portions that are end portions with a large cross section or small diameter portions that are end portions with a small cross section.

A connection structure, of a short bar forming a conductive path and a land on a printed circuit board, in which the short bar includes a plate portion having a flat plate shape and a protrusion protruding in a stepped shape from a surface of the plate portion, the protrusion is threadably fastened to the printed circuit board by a screw inserted into a land-side through hole formed through the land, from an opposite side of the printed circuit board with respect to the protrusion, in a state where a flat surface portion formed, at a position spaced apart from the surface of the plate portion, on an outer surface of the protrusion is in close contact with the land.