One example of a system includes a printed circuit board. The printed circuit board includes a switch chip footprint to receive a higher lane count switch chip or a lower lane count switch chip. The printed circuit board includes a plurality of transceiver module footprints. Each transceiver module footprint is electrically coupled to the switch chip footprint. Each transceiver module footprint may receive a higher lane count transceiver module or a lower lane count transceiver module.

An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which, when a nano-scale LED device according to the related art stands up and is three-dimensionally coupled to an electrode, it is difficult to allow the nano-scale LED device to stand up, and when the nano-scale LED devices are coupled to one-to-one correspond to electrodes different from each other, product quality is deteriorated. Thus, the nano-scale LED device having a nano unit may be connected to the two electrodes different from each other without causing defects, and light extraction efficiency may be improved due to the directivity of the nano-scale LED devices connected to the electrodes. Furthermore, deterioration in function of the LED lamp due to the defects of a portion of the nano-scale LEDs provided in the LED lamp may be minimized, and the LED lamp may have a flexible structure and shape by using the nano-scale LED electrode assembly of which a portion is deformable according to the used purpose or position of the LED lamp.

Solder pads, systems, and related methods are provided. A first or second pad include at least one shape for increasing a number of edges available to align at least one part to be soldered thereto. Each solder pad can occupy a same surface area of the substrate. A plurality of circuit elements can be provided over the plurality of solder pads, where some of the circuit elements occupy different surface areas of the substrate and/or the solder pad. A method of providing a solder pad includes providing a substrate, providing a solder pad over the substrate, and providing at least one shape in the solder pad for increasing a number of edges available to align at least one part to be soldered thereto. The pads can attach for example to a surface-mount ceramic component, a submount-free component, a leadframe component and/or a chip on board component.

An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.

The description relates to electronic prototyping platforms. One example can include an electrically insulative substrate having generally opposing first and second major surfaces and that includes an orientation feature that is visible on both of the first and second major surfaces. The example can include a first mounting hole through the substrate that is bordered by a first electrical conductor associated with data transmission. The example can also include a second mounting hole through the substrate that is bordered by a second electrical conductor associated with electrical ground, and a third mounting hole through the substrate that is bordered by a third electrical conductor associated with electrical power. The example can also include an edge connector tab defined by the substrate and having three exposed electrically conductive contacts that are coupled to the data electrical conductor, the ground electrical conductor, and the power electrical conductor and insulated from one another.

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

An electronic device includes a printed circuit board having a cutout, wherein an optoelectronic component including a housing having an outer surface, the housing has a chip receptacle space at a top side, an optoelectronic semiconductor chip is arranged in the chip receptacle space, the housing has a first soldering contact surface and a second soldering contact surface, the first soldering contact surface and the second soldering contact surface face in the same spatial direction as the outer surface, and the first soldering contact surface and the second soldering contact surface are set back relative to the outer surface, is arranged in the cutout.