Provided is an electronic apparatus including a printed board having on a front surface thereof a first region and a second region in each of which a circuit element is disposed, and a shield member formed by a single metal sheet and disposed such as to face the front surface of the printed board. The shield member has a first section that faces the first region and a second section that faces the second region, and at least a boundary section of the first section and the second section is electrically connected to a ground pattern of the printed board, the ground pattern being formed between the first region and the second region.

An electronic component module includes a first module including a sealing portion disposed on a first surface of a first board and a shielding layer disposed on a surface of the sealing portion, a second module spaced apart from the first module, a connection board having greater flexibility than the first board and connecting the first module to the second module, and a first ground line electrically connected to a ground layer of the first board and disposed on a surface of the connection board, and at least a portion of the shielding layer is electrically connected to the ground layer of the first board.

Provided is a method for masking a sensitive signal by injecting noise into planes of a printed circuit board (PCB). The method comprises detecting, by a secondary integrated circuit (IC), a noise signal on a shared plane of a PCB that includes the secondary IC. The noise signal may be analyzed to determine the characteristics of the noise signal. A masking signal may be generated based on the characteristics. The masking signal may then be injected onto the shared plane.

An electronic device including a shielding member for performing an electromagnetic interference (EMI) shielding function is provided. The electronic device includes a printed circuit board including a first area in which first electronic components having a first frequency as a driving frequency are mounted, and a second area in which second electronic components having a second frequency as a driving frequency are mounted, a shielding film disposed to cover the first area and the second area of the printed circuit board and attached to a first ground portion of the printed circuit board, and at least one conductive member formed to extend in a direction perpendicular to an extending direction of the printed circuit board. The at least one conductive member includes a first end that contacts the shielding film, and a second end that contacts a second ground portion of the printed circuit board, the second end being disposed between the first area and the second area of the printed circuit board.

A hybrid carrier board and a manufacturing method, an assembly, and an optical module thereof. The hybrid carrier board includes a PCB and a package substrate bonded to the PCB, the package substrate and the PCB being electrically connected. A surface of the package substrate is partially exposed outside of the PCB to form a packaging area adapted for bare die installation.

An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, wherein the first electronic component on the first circuit board is disposed corresponding to the first region, and the second electronic component on the first circuit board is disposed corresponding to the second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.

An example computing device enclosure can include a first printed circuit board (PCB) that includes a first plurality of components, where a first portion of the first plurality of components that are shorter than a threshold height are positioned on a first side of the first PCB and a second portion of the first plurality of components that are taller than the threshold height are positioned on a second side of the first PCB, and a second printed circuit board (PCB) that includes a second plurality of components, where a first portion of the second plurality of components that are shorter than the threshold height are positioned on a first side of the second PCB and a second portion of the second plurality of components that are taller than the threshold height are positioned on a second side of the second PCB.

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

An electronic arrangement (100) and a method of manufacturing an electronic arrangement are provided. The electronic arrangement comprises an array of electronic components (110) arranged along a first axis, A, and a carrier (120) arranged to support the array of electronic components, wherein the carrier comprises, a first metal layer (130), a second metal layer (140), and an at least partially insulating layer (150) arranged between the first and second metal layers. The electronic arrangement further comprises a partition portion (160) arranged between two adjacently arranged electronic components for partitioning the electronic arrangement, wherein the second metal layer comprises a void (180) intersected by the second axis, wherein the void has a width (190) which extends parallel to the first axis, such that, at the second axis, the second metal layer is undercut with respect to the first metal layer, in a direction parallel to the first axis.