A semiconductor device includes an insulating substrate including an insulating plate and a circuit plate disposed on a main surface of the insulating plate; a semiconductor chip having a front surface provided with an electrode and a rear surface fixed to the circuit plate; a printed circuit board facing the insulating substrate and including a metal layer; a conductive post having one end electrically and mechanically connected to the electrode and another end electrically and mechanically connected to the metal layer; a passive element fixed to the printed circuit board; and a plurality of positioning posts fixed to the printed circuit board to position the passive element.

There has been a problem of generating anti-resonance between a three-terminal capacitor and a capacitor when the three-terminal capacitor and the capacitor are mounted. In order to solve the problem, this electronic circuit includes: a capacitor and a three-terminal capacitor, which are connected to a power supply terminal of a circuit component, and a power supply, and which are connected in parallel to each other between the power supply and ground; and a resistor that is connected in series between the ground and a ground terminal of the three-terminal capacitor and/or the capacitor.

A method and apparatus for inputting a plurality of different circuit schematics designed with printed circuit board (PCB) mountable components; extracting circuit topologies for said plurality of different circuit schematics; transforming said extracted circuit topologies to a fixed number of connection points; and generating a configurable circuit PCB physical layout pattern having said fixed number of connection points such that said PCB mountable components when positioned on one or more of said fixed number of connection points can implement any circuit represented by said plurality of different circuit schematics.

A battery, for example, a rechargeable battery (e.g. lithium ion battery) having a casing with battery terminals. The casing, for example, includes an upper section, middle section, and lower section connected together. The battery can be connected to one or more battery trays having the same height or different heights for various applications.

Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall.

The electrical circuit can include a line circuit portion having a number of shared resistor pads, where each shared resistor pad is electrically coupled to an electrically conductive line lead, where the electrically conductive line lead carries a voltage capable of operating an electrical load. The electrical circuit can also include a load circuit portion comprising a number of unshared resistor pads. The electrical circuit can further include at least one zero ohm resistor electrically coupled to at least one shared resistor pad. The at least one zero ohm resistor can be configurable after manufacturing the printed circuit board. The load circuit portion can be electrically isolated from the line circuit portion in the absence of the at least one zero ohm resistor being further electrically coupled to at least one unshared resistor pad.

A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ≦500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ≦15 μm.

A polysiloxane film comprises Si—O bonds and has a thickness of 0.3 to 1.5 microns. Adjacent electrodes coated with the polysiloxane film have a leakage current of at most 0.01 mA at 10 V after contact with water. An electrode coated with the polysiloxane film has a contact resistance of at least 0.01 ohms at 1.0 mm of pogo pin compression under a 1.0 N load. The polysiloxane film provides IPx7 protection from ingress of water.

Provided are a flexible circuit mother board and a detection method. The flexible circuit mother board includes flexible circuit daughter boards, at least one detection terminal group and external pad groups corresponding to the flexible circuit daughter boards in one-to-one correspondence. Each flexible circuit daughter board has a bonding pad area adjacent to a corresponding one of the plurality of external pad groups. Each detection terminal group detects at least one flexible circuit daughter board, and each of the at least one detection terminal group comprises a plurality of detection terminals. Each flexible circuit daughter board includes a plurality of capacitors including a first electrode plate and a second electrode plate. Each of the first electrode plate and the second electrode plate is electrically connected to one detection terminal.

A power supply unit for an aerosol inhaler includes: a case; a power supply that discharges power to a load for generating an aerosol from an aerosol generation source; a discharging terminal that connects the load to the power supply; a charging terminal that connects the power supply to an external power supply and is separated from the discharging terminal; a temperature measuring unit that measures temperature of the power supply; and a control device that controls an effective value of a first charging current to a value smaller than an effective value of a second charging current. The first charging current is supplied to the power supply when a measurement value of the temperature measuring unit is equal to or higher than a first threshold and the second charging current is supplied to the power supply when the measurement value is lower than the first threshold.