The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

In one embodiment, the substrate is configured for a semiconductor laser diode and comprises a plurality of substrate layers. The substrate layers include insulating layers and carrier layers, which are thicker. A plurality of electrical contact surfaces, which are configured for the semiconductor laser diode, a laser capacitor and a control chip, are located on an assembling side of a first, uppermost substrate layer, which is an insulating layer. Electrical conductor tracks, which electrically interconnect the contact surfaces, are located on the one hand between the first insulating layer and a second insulating layer, and on the other hand between the second insulating layer and a third substrate layer, which is preferably an insulating layer.

An optical module (100) for reading a test region of an assay. The optical module comprises: a first light source (101) for illuminating the test region of the assay; an optical detector (103), comprising an optical input for receiving light emitted from the test region and an electrical output; a substrate (104) for mounting the first light source (101) and the optical detector (103); and a housing (105) comprising: a first opening (106) for providing a first optical path from the first light source (101) to the test region (103); wherein the housing (105) and the substrate (104) enclose and positionally align the first source (101) and the optical detector (103) relative to the first opening (106). The housing (105) may comprise one or more legs (108), such as a flexible hook portion which secures the housing (105) to the substrate (104) with a snap-fit engagement, extending from a first and/or second outer surface of the housing (105) in a vertical direction. Beneficially, the snap-fit engagement provided by the flexible hook portion allows the housing to be aligned and secured without the need to use glue or for example a screw and thread that can be difficult to control and/or risks misalignment of the housing.

A device includes comprising first and second printed circuit boards. Walls couple the first and second printed circuit boards to each other and define a first cavity between the first and second printed circuit boards. Electric conductors associated with the walls electrically connect the the first and second printed circuit boards. An integrated circuit chip is mounted to a first surface of the first integrated circuit board in the first cavity. The integrated circuit chip is electrically connected to conductive tracks of the first surface of the first printed circuit board. Surface-mounted components are mounted on top of and in contact with conductive tracks of a first surface of the second printed circuit board. The first surfaces of the first and second printed circuit boards are arranged facing towards each other. The first and second printed circuit boards may form rigid components of a flex-rigid type printed circuit board.

A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.

An actuator is disclosed having a sensor substrate, a coil substrate and an FPC. The sensor substrate includes an image sensor on a front surface thereof. The coil substrate includes a coil for driving the image sensor and is provided with a first through hole. The FPC includes a main body portion and a coupling portion extending from a periphery of the main body portion and is coupled to an outside element. The main body portion is provided with a second through hole. The sensor substrate is fixed to the main body portion from a rear side, the coil substrate is fixed to the main body portion from a front side, and the image sensor is exposed to a front surface through the first through hole and the second through hole.

A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m.Math.K or more; a light-emitting element that has a cathode electrode and an anode electrode and is provided on a front surface side of the base member; a capacitive element that is provided on the base member and supplies an electric current to the light-emitting element; and a reference potential wire that is provided on a rear surface side of the base member and is connected to an external reference potential. The reference potential wire is connected to the capacitive element and is insulated from the cathode electrode and the anode electrode.

A camera module includes a circuit board; and a lens module electrically connected with the circuit board. The lens module is configured to be capable of deformed when being applied a voltage thereon so as to change a focus length of the lens module.

A lens module includes a circuit board, a base mounted on the circuit board, and at least one electronic component mounted on the circuit board. The base comprises a first surface and a second surface facing away from the first surface. The second surface is mounted on the circuit board. The base further comprises at least one first hole passing through the first surface and the second surface. The at least one electronic component is received in the at least one first hole. The lens module further comprises a filling layer in each of the at least one first hole and located on a side of the at least one electronic component facing away from the circuit board. The disclosure also provides an electronic device having the lens module.