An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature T and a resistance of the double-resin ink at 25 degrees Celsius.

An electronic module includes a shunt resistor having one end that is connected to one end of a first ground wiring line and another end that is connected to another end of a second ground wiring line. Signal terminals are disposed to be close to the shunt resistor, the signal terminals including a first current detection terminal electrically connected to the one end of the shunt resistor, and a second current detection terminal disposed to be close to the shunt resistor and electrically connected to the other end of the shunt resistor. The shunt resistor is disposed to be close to a first side of a substrate along which the signal terminals are arranged.

An adjustable and pluggable control interface device with a sensor thereof includes a sensor and at least one adjusting member. The sensor includes a PCB, a sensing portion and at least one adjusting portion. The PCB is electrically connected to the sensing portion and the adjusting portion, respectively, and the at least one adjusting portion is configured to adjust output signals of the PCB. The at least one adjusting member is inserted into the adjusting portion for adjusting the output signals of the PCB. The structure of the present disclosure can control external lamps to light or extinguish so as to realize the functions of dimming light brightness, setting light duration, adjusting energy-saving parameters and proportion. So, such structure can be easily operated with a wide range of applications.

Provided is a temperature sensor including a carrier substrate; a sensor unit positioned on the carrier substrate and including a base layer and an electric conductive layer, the base layer having surface hygroscopicity, and the electric conductive layer being on an external surface of the base layer; a pad unit electrically connected to opposite ends of the sensor unit; and a cover unit positioned on the sensor unit and configured to cover the sensor unit.

The invention relates to an assembly with an electrotechnical component on a carrier. A first electrical connecting line and a second electrical connecting line going to the electrotechnical component are provided on or in the carrier. The electrotechnical component comprises a first connection and a second connection. The first connection is attached on the carrier by a thermally softenable solder material to the first electrical power supply line, and the second connection is attached on the carrier by a thermally softenable solder material to the second electrical power supply line. A first electrical signal line to the electrotechnical component is provided on or in the carrier. The assembly furthermore comprises a mechanical prestressing, which in the event that the solder material is softened can displace the electrotechnical component on the surface substantially in a parallel plane to the carrier or orthogonally to the carrier.

Provided are a radio frequency identification tag and a method of manufacturing the same. The radio frequency identification tag includes a substrate, an antenna unit provided on the substrate and configured to transmit and receive signals, an integrated circuit unit spaced apart from the antenna unit on the substrate, and an interrupter and a delay circuit unit connected in parallel between the antenna unit and the integrated circuit unit, wherein the interrupter includes a variable portion and a fixed portion opposite the variable portion, wherein the delay circuit unit includes a capacitor and a resistor.

A solid state circuit breaker assembly includes a transistor, a transient voltage suppression device, and a circuit board. The transistor and/or the transient voltage suppression device may be electrically connected to the circuit board. The solid state circuit breaker module may be configured to be connected to one or more non-scalable modules to regulate current. The solid state circuit breaker module may be configured to receive one or more scalable modules. The transistor and/or the transient voltage suppression device may be disposed on the circuit board in a substantially symmetrical configuration.

An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature T and a resistance of the double-resin ink at 25 degrees Celsius.

A printed circuit that comprises a substrate, electrical interconnects and a double-resin ink having a positive temperature coefficient (PTC), wherein the double-resin ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the double-resin ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature T and a resistance of the double-resin ink at 25 degrees Celsius. The substrate is a fabric or mesh, while the double-resin ink and the electrical interconnects are deposited onto the substrate.

A substrate is disclosed. In an embodiment, a substrate includes a ceramic main body, an organic surface structure on at least one first outer face of the ceramic main body and outer redistribution layers integrated into the organic surface structure.