An abnormal temperature detection system that detects an abnormal temperature in a cable used to transmit power to a electrical device. The abnormal temperature detection system includes first and second conductors that are disposed along a longitudinal axis direction of the cable, and a plurality of temperature-responsive electronic components that are disposed along the longitudinal axis direction of the cable and are electrically connected to the first and second conductors. The first and second conductors and the plurality of temperature-responsive electronic components form an electrical circuit. An abnormal temperature is detected on the basis of an electrical signal acquired from the electrical circuit.

An apparatus for discriminating between liquids having differing thermal conductivities includes a thermally conductive substrate, a resistor and a thermistor mounted to the thermally conductive substrate. Two leads on the resistor enable a current to be passed through the resistor to generate heat, and two leads on the thermistor enable a current to be passed through the thermistor to generate a datum indicative of thermistor temperature. An electrical insulator encapsulates the resistor, the thermistor and part of the thermally conductive substrate. A remainder of the thermally conductive substrate may extend beyond the electrical insulator to provide a thermal path from the resistor and thermistor to a liquid in which the apparatus may be immersed.

An apparatus includes a transmitter circuit configured to provide a transmitted waveform at a transmitter output, and a first microstrip differential trace extending from a first microstrip differential trace first end to a first microstrip differential trace second end. A first resistor has a first resistor first end coupled to the transmitter output and a first resistor second end coupled to the first microstrip differential trace first end. A second microstrip differential trace extends from a second microstrip differential trace first end to a second microstrip differential trace second end. A second resistor has a second resistor first end coupled to the transmitter output and a second resistor second end coupled to the second microstrip differential trace first end. A first receiver circuit has a first receiver circuit input coupled to the first microstrip differential trace second end, the first receiver configured to provide a first received signal. A second receiver circuit has a second receiver circuit input coupled to the second microstrip differential trace second end, the second receiver configured to provide a second received signal. A processor may receive the first received signal and the second received signal and perform digital signal processing on the first received signal and the second received signal, detect a coolant leak, and provide an alert upon detection of the coolant leak.

A thermal substrate that comprises a high-resistance magnification (HRM) positive-temperature coefficient (PTC) ink and a substrate, wherein the HRM PTC ink has a positive temperature coefficient (PTC) and a resistance magnification of at least 15 in a temperature range of at least 20 degrees Celsius above a switching temperature of the HRM PTC ink.

A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

An overvoltage protection device having a printed circuit board, varistor, and gas discharge tube, the varistor and discharge tube connected in series between a first and second electrical terminal of the circuit board via conductive tracks, wherein: the varistor is connected to the first terminal by a first track, the discharge tube is connected to the varistor by a second track, the discharge tube is connected to the second terminal by a third track, and wherein the second and third tracks have curved portions situated on either side of the discharge tube, having a concavity facing in the same orientation respective to the discharge tube and a thermofusible area able to separate the corresponding track into two parts in response to an overcurrent, the distance between the two parts of each track allowing generation of an arc in response to an overvoltage that activates the discharge tube.

A substrate is disclosed. In an embodiment, a substrate includes a ceramic main body, an organic surface structure on at least one first outer face of the ceramic main body and outer redistribution layers integrated into the organic surface structure.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.

A contaminant detector is capable of sending a signal or alert when a contaminant is detected within a housing of a utility meter, a meter transmission unit (MTU), or other associated equipment. Circuitry enclosed within the housing is capable of detecting utility usage, transmitting information between one or more utility meters and a utility provider, and/or otherwise monitoring or tracking utility usage. The contaminant detector includes a resistive voltage divider network having a resistance that varies when in contact with a contaminant such as a form of water or metal. The variable resistor has a serpentine structure comprising a plurality of detective fingers that are formed from conductive material and separated by a non-conductive substance.