A component for a vehicle electric drive is described, which includes at least one connecting lug pair projecting from the component for electrically connecting the component. Here, a first connecting lug and a second connecting lug of the connecting lug pair each have a joining zone for electrically connecting the component. Furthermore, an assembly for a vehicle electric drive is presented, which has at least two such components. Further presented is a method of electrically conductively connecting two components.

Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a radiation shield groove that extends past a surface of the support structure and into the support structure, a radiation source on the substrate, and a radiation shield around the radiation source, where the radiation shield includes a wall secured to the support structure and a groove channel coupling wall that extends past a surface of the support structure and into the radiation shield groove.

A board-like structure includes a base body, an internal conductor, a connection conductor, and a terminal member. The base body is an insulating member including an upper surface and a lower surface on an opposite side to the upper surface. The internal conductor runs along the upper surface and the lower surface inside the base body. The connection conductor is connected to the internal conductor inside the base body. The terminal member is connected to the connection conductor inside the base body and is exposed to an external portion of the base body at the lower surface. The connection conductor is longer in length in a vertical direction than a thickness of the internal conductor in the vertical direction. In the terminal member, at least a side surface is connected to the side surface of the connection conductor.

A circuit board to be secured to a support member includes a first structure, a second structure, and a third structure. The first structure prevents the circuit board from moving in a horizontal direction with respect to the support member. The second structure prevents the circuit board from rotating around the first structure with respect to the support member. The third structure prevents the circuit board from moving in a vertical direction with respect to the support member. A distance between the first structure and the second structure is shorter than a distance between the first structure and the third structure.

A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid there thorough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.

A power module for operating an electric vehicle drive, comprising power switches for generating an output current based on an input current; control electronics for controlling the power switches including a first region, to which a first electric potential is applied, and a second region, to which a second electric potential is applied, wherein the second electric potential is higher than the first electric potential; a heatsink for discharging heat generated by the power switches and the control electronics; a shielding layer for electrically shielding the control electronics placed between the heatsink and the control electronics, such that the control electronics lies on the shielding layer, and the shielding layer lies on the heatsink; wherein the shielding layer is designed to connect the heatsink thermally and electrically to the first region, and thermally to the second region, and electrically insulate it therefrom.

An electronic apparatus includes a flexible printed circuit board having a main body on which wiring pattern is formed, a connector having a connection terminal connected to the wiring constituting the wiring pattern, and a base body on which the connection terminal is fixed, and a casing. The main body is attached to the casing to be movable, the flexible printed circuit board has an extension part protruding from the main body and extending along with a ground included in the wiring pattern, the extension part bends in the middle of extending to be capable of expansion and contraction, and has a mounting part fixed to the casing on the tip side thereof, the mounting part is provided with a ground terminal connected to the ground extended, and the ground terminal is electrically connected to the casing in the state that the mounting part is fixed to the casing.

A stacked circuit card assembly includes a power supply having a positive terminal and a negative terminal, a first circuit card having a first via electrically connected to the positive terminal and a second via electrically connected to the negative terminal, and a second circuit card having a third via aligned with the first via and a fourth via aligned with the second via. The assembly further includes a first conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card, and a second conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card. The first conductive stand-off provides a conductive pathway between the first via and the third via, and the second conductive stand-off provides a conductive pathway between the second via and the fourth via.

The present disclosure generally relates to a computer circuit board having an integrated voltage regulator assembly that may include a heat sink and at least one voltage regulator module board. The heat sink may have a metal plate with at least one recess in which the voltage regulator module board may be attached. The voltage regulator module board is electrically coupled to a semiconductor package and the heat sink is thermally coupled to the semiconductor package. The computer circuit board is used in high-performance computing devices including computer workstations and computer servers.

The present disclosure generally relates to a scalable computer circuit board having a first power level semiconductor package coupled to at least one base-level voltage regulator module, which is coupled to a plurality of connection receptacles that are configured for connecting with a voltage regulator module positioned on a second level, as a standardized base unit. To scale the base unit, a second power level semiconductor package may be exchanged for the first power level semiconductor package in conjunction with one or more voltage regulator module board being positioned over a corresponding number of base-level voltage regulator modules and coupled to their plurality of connection receptacles.