An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

An insulator interface serves as both an insulator and the forming tool for a busbar. The busbar insulator interface includes a hollow riser having at least one channel extending between first and second openings at opposite ends of the riser, a busbar forming section located at one of the first and second openings of the riser and a terminal locating section extending from the busbar forming section, wherein the busbar forming section is configured for folding a busbar onto the terminal locating section. A busbar assembly includes a combination of a single piece busbar and an insulator interface. The busbar has one end pre-formed and other end straight to allow the busbar to pass through the insulator interface. The busbar insulator interface is designed to act as the forming tool with the proper bend radius for the busbar.

An electronic device is provided, which includes a PCB including a first surface and a second surface facing in a direction opposite to the first surface; and an interface terminal positioned at least partially on the first surface of the PCB, The interface terminal includes a shell including a hollow portion extending from a first opening on a first side of the shell to a second opening on a second side of the shell, a terminal structure including a non-conductive plate positioned in the hollow portion and a plurality of terminals positioned on the non-conductive plate, a first bracket that at least partially covers a surface of the shell, and a second bracket that at least partially covers another surface of the shell. The second bracket includes a protrusion protruding with respect to the second surface of the PCB.

An assembly structure of a transformer and a circuit board includes: a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate and a first heat sink. The packaging chip is disposed on the circuit board. The transformer has at least one first output electrode and at least one second output electrode connected to the first output electrode. The first conductive plate is disposed on the transformer and connected to the at least one first output electrode. The second conductive plate is disposed on the transformer and connected to the at least one second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate.

There is provided a light irradiator including: light sources forming first and second light source rows; a heat sink; a substrate including first and second traces connected to the first and second light source rows, respectively; and a fixing part configured to fix the heat sink to the substrate. The fixing part is arranged between adjacent light sources included in the first light source row and adjacent in the first light source row; and the fixing part is not arranged between adjacent light sources included in the second light source row and adjacent in the second light source row. The first trace includes a first circumventing part configured to circumvent the fixing part; and the second trace includes a second circumventing part configured to circumvent the fixing part and having a directional component different from the first direction.

An insulator interface serves as both an insulator and the forming tool for a busbar. The busbar insulator interface includes a hollow riser having at least one channel extending between first and second openings at opposite ends of the riser, a busbar forming section located at one of the first and second openings of the riser and a terminal locating section extending from the busbar forming section, wherein the busbar forming section is configured for folding a busbar onto the terminal locating section. A busbar assembly includes a combination of a single piece busbar and an insulator interface. The busbar has one end pre-formed and other end straight to allow the busbar to pass through the insulator interface. The busbar insulator interface is designed to act as the forming tool with the proper bend radius for the busbar.

An electronic module utilizing a bathtub heatsink and single-cover design to provide improved thermal management and fault isolation while minimizing cost and complexity. The electronic module may also provide for better galvanic corrosion prevention through the utilization of a single finish on the components thereof. Further provided may be an electronic module design utilizing a single set of fasteners, which may further reduce assembly cost and complexity while further providing increase galvanic corrosion prevention.

An example apparatus includes a cover to shield, at least partly, a conductive trace on a surface of a circuit board from electromagnetic interference. The cover includes a conductive surface that faces the conductive trace. The cover at least partly encloses a volume over the conductive trace. The volume is for holding air over the conductive trace. One or more contacts electrically connect the conductive surface of the cover to electrical ground on the circuit board.

A flexible intelligent electrical switching device with multi-function capability, and methods of use are presented herein which provide an autonomous, reconfigurable switching device. The present disclosure is specifically designed to reduce space, cost of manufacture, efficiency, installation reduction time and ease of implementation.

A system-in-package cellular assembly is disclosed. The assembly may include a main board including a multi-layer printed circuit board. The main board may include one or more through holes and be detachably connectable to an end-product via the one or more through holes and one or more connecting members. The main board may be reversibly, electrically couplable to the end-product via the one or more through holes and the one or more connecting members. The assembly may include an add-on board including one or more through holes and be detachably connectable to the main board via one or more connectors. The add-on board may be reversibly, electrically couplable to the main board via one or more main board surface mount connectors and one or more add-on board surface mount connectors. The add-on board may include at least one of one or more sensors or one or more sensor through holes.