A method for protecting an assembled circuit board by providing a layer of rosin micro-spheres directly on the components to be protected, heating the micro-spheres to a temperature of about 65 C. for a time sufficient to cause the micro-spheres to flow and the rosin to crosslink, and then allowing the board to cool until the rosin returns to its solid state. The rosin micro-spheres may be put onto the board and components by first loading the microspheres onto a transfer tape and then positioning the transfer tape, microspheres down, over the components to be protected. After the rosin is heated the tape may be removed. The method is effective for protecting assembled boards against airborne S to prevent creep corrosion of the copper metallization, and for protecting against Sn to prevent the formation of tin whiskers in tin-plated or soldered lead-free assemblies.

The present disclosure relates to a method for the process-reliable soldering of a chip package onto a printed circuit board for the process-reliable soldering of a chip package. The printed circuit board has a metallic cooling surface, a plurality of metallic contact surfaces surrounding the cooling surface, and, on a side opposite the cooling surface, a rear metallic mating surface, the mating surface being connected to the cooling surface by open vias, and lanes of solder resist being arranged on the cooling surface, which lanes both divide the cooling surface into a plurality of partial surfaces and enclose the vias.

The invention includes methods of forming electronic circuitry on a target surface using intense pulsed light-induced mass transfer (IPLMT) of metal nanoparticles (NPs) by applying a pliable mask to a target surface, coating a carrier film with metal NPs, mounting the carrier film to the target surface and over the pliable mask so that the pliable mask is sandwiched between the target surface and the metal NPs. and exposing the metal NPs to light energy to cause atoms of the metal NPs to evaporate and transport through openings of the pliable mask and condense on the target surface, producing a conductive pattern of condensed metal on the target surface. Certain implementations may utilize a kirigami-patterned pliable mask to enhance conformity to a freeform 3D target surface. In certain implementations, zinc (Zn) may be formed by IPLMT of Zn NPs to the target surface.

A grid of connection points or surface mount features electrically and/or communicatively couples a first computing component to a second computing component. The grid of connection points include a first connection point type having a first structure and a second connection point type having a second structure. In an example, the first connection point type is a solder ball that is associated with a single signal pin and the second connection point type is a solder bar that is associated with multiple signal pins. One or more of the second connection point types are positioned at and/or around a perimeter of the first computing component, which reduces strain, stress and/or other mechanical forces on the first connection point types and/or on the first computing component and/or the second computing component.

A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.

A printed circuit board manufacturing method and a printed circuit board thereof are disclosed. The printed circuit board manufacturing method includes the steps of: providing a dielectric; performing a layout process on a surface of the dielectric; drilling the dielectric to form at least one plated through hole, wherein the at least one plated through hole has an annular ring disposed on the surface of the dielectric; and coating a solder resist on the surface of the dielectric to cover at least one part of the annular ring.

A method for protecting an assembled circuit board by providing a layer of rosin micro-spheres directly on the components to be protected, heating the micro-spheres to a temperature of about 65 C. for a time sufficient to cause the micro-spheres to flow and the rosin to crosslink, and then allowing the board to cool until the rosin returns to its solid state. The rosin micro-spheres may be put onto the board and components by first loading the microspheres onto a transfer tape and then positioning the transfer tape, microspheres down, over the components to be protected. After the rosin is heated the tape may be removed. The method is effective for protecting assembled boards against airborne S to prevent creep corrosion of the copper metallization, and for protecting against Sn to prevent the formation of tin whiskers in tin-plated or soldered lead-free assemblies.

According to the invention, there are provided a conductive film which has a mesh-like metal layer composed of metal thin wires and in which visual recognition of the metal thin wires is suppressed and the metal layer has excellent conductive characteristics, a touch panel sensor, and a touch panel. A conductive film according to the invention includes a substrate; a patterned to-be-plated layer which is disposed on the substrate in a mesh pattern and has a functional group interacting with a plating catalyst or a precursor thereof; and a mesh-like metal layer which is disposed on the patterned to-be-plated layer and has a plurality of metal thin wires intersecting each other, an average thickness of the patterned to-be-plated layer is 0.05 to 100 m, an average thickness of the metal layer is 0.05 to 0.5 m, and an average intersection growing rate at an intersection of metal thin wires of the mesh of the metal layer is 1.6 or less.

A method for forming a structure for a radio frequency identification device includes dispensing a photosensitive compound onto a substrate. Subsequently, first portions of the photosensitive compound are exposed to a light pattern from a light source, while second portions of the photosensitive compound remain unexposed to the light source. Exposing the photosensitive compound to light reduces the photosensitive compound to a metal layer. The unexposed second portions of the photosensitive compound may be rinsed away to leave the metal layer. Processing may continue to form an RFID circuit from the metal layer, and a completed RFID transponder comprising the RFID circuit.