A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.

A composite part comprising an electronic device and method for making the same. A primer is deposited on a surface of the composite part. An electronic device comprising a group of conductive elements is deposited on the primer. An embodiment may include the group of conductive elements within a layer of material co-bonded to the composite part. Power may be supplied to a device connected to the composite part through current flowing through the group of conductive elements.

Various embodiments include a circuit arrangement comprising: a heat sink; and a set of layers arranged on a surface of the heat sink. The set of layers includes a first electrically insulating insulation layer and an electrically conductive conductor layer arranged on a side of the insulation layer facing away from the heat sink. The set of layers includes an electrical connecting path between two electrical connection regions. At least one layer of the set of layers is formed by cold gas spraying of a respective material.

A method for printed cable installation in a harness system of an aircraft. The method includes: printing at least a first conductive trace comprising conductive particles to a surface of an aircraft with a printing technology; printing at least second conductive trace comprising conductive particles to the surface of an aircraft with the printing technology; sintering the first and the second conductive traces by a laser, and interposing an insulating film between the first and the second conductive traces. For a trace length less than 5 meters, the first and second conductive traces provide the electromagnetic compatibility of a twisted pair of wires when printed with a guard trace.

A device may include a flexible substrate. The device may further include a flexible integrated circuit within the flexible substrate, the integrated circuit having at least one input electrode positioned on a surface of the flexible substrate. The device may also include an aerosol jet printed conductive ink layer disposed on the surface of the flexible substrate, the aerosol-jet printed conductive ink layer having a pattern that includes a first set of fingers interdigitated with a second set of fingers, the aerosol jet printed conductive ink layer in contact with the at least one input electrode.

The invention relates to a method for producing a coil integrated in a substrate or applied to a substrate, wherein the coil has first winding portions, which each have first ends and second ends, and wherein the coil has second winding portions and third winding portions, wherein each two of the first ends are electrically interconnected by the second winding portions and two corresponding second ends of the first winding portions are electrically interconnected by the third winding portions, such that coil windings of the coil are formed hereby, wherein at least the first winding portions are applied by means of a 3D printing method, wherein this is aerosol jet or inkjet printing, for example.

A method for forming a conductive trace on a substrate. A metallic liquid is mixed with a solvent to produce a metallic liquid mixture. The metallic liquid mixture is stimulated to produce a colloidal suspension of discrete metallic liquid particles surrounded by the solvent. The colloidal suspension is aerosolized with a carrier gas, and passed through a nozzle to deposit the discrete metallic liquid particles onto the substrate. The deposited discrete metallic liquid particles are annealed, thereby producing the conductive trace. The conductive trace has a substantially contiguous core of the metallic liquid within a substantially non-electrically conductive solid skin that substantially bounds the liquid core.

An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.

A method for manufacturing a circuit carrier for electronic components includes making available a carrier material layer made of an electrically insulating material and having at least one connecting layer which is applied at least to a first and/or second surface of the carrier material layer and has in each case a predefined layer thickness. Each connecting layer has a number of electrically conductive connections with a predefined conductor track width. At least some of the connections are strengthened by plasma spraying, at least in certain sections, with additional electrically conductive material. As a result, a greater layer thickness than the predefined layer thickness and/or a larger conductor track width than the predefined conductor track width is obtained. Furthermore, a circuit carrier for electronic components is specified.

A method for forming a conductive trace on a substrate. A metallic liquid is mixed with a solvent to produce a metallic liquid mixture. The metallic liquid mixture is stimulated to produce a colloidal suspension of discrete metallic liquid particles surrounded by the solvent. The colloidal suspension is aerosolized with a carrier gas, and passed through a nozzle to deposit the discrete metallic liquid particles onto the substrate. The deposited discrete metallic liquid particles are annealed, thereby producing the conductive trace. The conductive trace has a substantially contiguous core of the metallic liquid within a substantially non-electrically conductive solid skin that substantially bounds the liquid core.