An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.

The invention relates to a process for applying a coating material to a surface, comprising the steps of:providing a stream of gas mixture (8) comprising a carrier gas and a coating material (2),feeding the stream of gas mixture (8) onto the surface (3a), wherein the stream of gas 12 s mixture (8) impinges on the surface (3a) and the coating material (2) applied there forms an area of impingement (11) on the surface (3a)coupling at least one laser beam (7) into the stream of gas mixture (8),wherein the coupled-in energy of the at least one laser beam (7) is determined in such a way that the solid coating material (2) at least partially melts andwherein each laser beam (7) is directed onto the stream of gas mixture (8) in such a way that the laser beam (7) does not fall on the area of impingement (11) on the surface. The invention also relates to a device for carrying out the process.

The invention relates to a method for applying an image of an electrically conductive material onto a recording medium. In the method, the recording medium is heated and the electrically conductive material is jetted onto the recording medium. The invention further relates to a device for ejecting droplets of an electrically conductive fluid onto a recording medium.

A structure including at least one electrical line on one surface of the structure, one electrically conductive layer of the line resulting from deposition of an electrically conductive material via a cold spraying method, and the line includes a protective bonding layer on which the electrically conductive material is deposited via the cold spraying method, the protective bonding layer forming a continuous protective shield between the structure and the cold-sprayed material. An insulating layer is advantageously located between the structure and the protective bonding layer. Achieving an electrical line on a surface of the structure involves implementing a step of oxy-fuel flame spraying of a protective material to form a protective bonding layer, followed by a step of cold spraying of the electrically conductive material of the electrically conductive layer onto the protective bonding layer.

Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.

During fabrication of shielded radio-frequency modules where costly metallic paint is sprayed to form a conductive layer, it is desirable to reduce the amount of paint being utilized, and to reduce the likelihood of accumulation of metal particles along various paths. A closed recirculation system can be provided to yield such desirable features, and can include a reservoir for holding a volume of metallic paint, a spray apparatus for spraying metallic paint received from the reservoir, and a recirculator for recirculating the metallic paint that is not sprayed back to the reservoir. In some embodiments, the spray apparatus can be implemented so as to have reduced dimensions, and include a mechanism for switching between a spray mode and a recirculate mode. Such a spray apparatus can reduce the amount of paint being utilized, and also reduce accumulation of metal particles in the spray apparatus.

A method of achieving precision registration in a roll to roll process by simultaneously depositing multiple inks onto a printing roll. One of these inks prints a pattern of fiducial marks onto a substrate while another ink prints a predetermined pattern on the same substrate such that the predetermined pattern bears a predictable spatial relationship to the pattern of fiducial marks. Consequently, even if the ink forming the predetermined pattern is invisible, or has such low contrast with the substrate that it is effectively invisible, or even has been dissolved away in a subsequent processing step, it is still possible to know where the predetermined pattern is by referring to the pattern of fiducial marks.

Provided is a light emitting device. In one embodiment, a light emitting device including: a support member; a light emitting structure on the support member, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a protective member at a peripheral region of an upper surface of the support member; an electrode including an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode.