An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.

A composite part comprising an electronic device and method for making the same. A primer is deposited on a surface of the composite part. An electronic device comprising a group of conductive elements is deposited on the primer. Power may be supplied to a device connected to the composite part through current flowing through the group of conductive elements.

A method for creating patterned coatings on a molded article includes providing a molded article which has a surface comprising a first area and a second area, at least one surface property in the first area of the surface being different from that in the second area, applying a coating covering at least the first area and the second area to the surface of the molded article, the adhesion of said coating being greater in the first area than in the second area because of the at least one different surface property, and partially removing the coating by means of a removal process which is applied to the entire coating at a constant removal power that is determined such that the entire coating is removed in the second area while the coating remains in place on an entire surface of the first area.

A device may include a flexible substrate. The device may further include a flexible integrated circuit within the flexible substrate, the integrated circuit having at least one input electrode positioned on a surface of the flexible substrate. The device may also include an aerosol jet printed conductive ink layer disposed on the surface of the flexible substrate, the aerosol-jet printed conductive ink layer having a pattern that includes a first set of fingers interdigitated with a second set of fingers, the aerosol jet printed conductive ink layer in contact with the at least one input electrode.

An integrated circuit assembly may be fabricated having an electronic substrate, an integrated circuit device having a first surface, an opposing second surface, at least one side extending between the first surface and the second surface, and at least one through-substrate via extending into the integrated circuit device from the second surface, wherein the first surface of the integrated circuit device is electrically attached to the electronic substrate; and at least one power delivery route electrically attached to the second surface of the integrated circuit device and to the electronic substrate, wherein the at least one power delivery route is conformal to the side of the integrated circuit device and the first surface of the electronic substrate.

A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.

A method for manufacturing a composite part. Layers of composite material are cured to form the composite part. A primer is depicted on a surface of the composite part. A group of conductive elements is deposited on the primer to form an electronic device on the primer.

A printed circuit board manufacturing method and a printed circuit board thereof are disclosed. The printed circuit board manufacturing method includes the steps of: providing a dielectric; performing a layout process on a surface of the dielectric; drilling the dielectric to form at least one plated through hole, wherein the at least one plated through hole has an annular ring disposed on the surface of the dielectric; and coating a solder resist on the surface of the dielectric to cover at least one part of the annular ring.

An integrated circuit assembly may be fabricated having an electronic substrate, an integrated circuit device having a first surface, an opposing second surface, at least one side extending between the first surface and the second surface, and at least one through-substrate via extending into the integrated circuit device from the second surface, wherein the first surface of the integrated circuit device is electrically attached to the electronic substrate; and at least one power delivery route electrically attached to the second surface of the integrated circuit device and to the electronic substrate, wherein the at least one power delivery route is conformal to the side of the integrated circuit device and the first surface of the electronic substrate.

A method for providing a metallic coat covering a surface is disclosed, which comprises: (i) applying an electrically conductive two component binder on said surface; (ii) electrostatic spraying a metal powder on the binder applied in step (i); wherein the metal powder comprises metal particles with an average diameter less than 80 micron.