An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

A method of manufacturing a component carrier includes: i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, with at least one cavity formed in the stack, ii) forming a cluster by encapsulating a first electronic component and a second electronic component in a common encapsulant, and thereafter iii) placing the cluster in the common encapsulant at least partially into the cavity and v) embedding the cluster in the cavity.

A method of manufacturing first and second component carriers includes: i) providing a separation component comprising a first separation surface and a second separation surface being opposed to the first separation surface, ii) coupling a first base structure having a first cavity with the first separation surface, iii) coupling a second base structure having a second cavity with the second separation surface, iv) placing a first electronic component in the first cavity, v) connecting the first base structure with the first electronic component to form the first component carrier, vi) placing a second electronic component in the second cavity, vii) connecting the second base structure with the second electronic component to form the second component carrier, viii) separating the first component carrier from the first separation surface of the separation component, and ix) separating the second component carrier from the second separation surface of the separation component.

A component carrier including an electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The electronic component directly contacts the component contacting end. The wiring contacting end is directly electrically contacted to the wiring structure. The exterior surface portion of the coupling structure has homogeneous ablation properties and surface recesses filled with an electrically conductive wiring structure. A method includes embedding an electronic component in an electrically insulating core, providing a coupling structure with a conductive connection having a component end and a wiring end, connecting the electronic component directly to the component end, providing a surface portion of the coupling structure with homogeneous ablation properties, patterning the surface portion with recesses and filling the recesses with a wiring structure such that the wiring end is contacted directly.

A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

A printed wiring board includes a core substrate having cavity to accommodate an electronic component and including a front conductor layer formed on front side of the core substrate, and a back conductor layer formed on back side of the core substrate, through-hole conductors formed through the core substrate such that the through-hole conductors connect the front and back conductor layers of the core substrate, a front build-up layer formed on front surface of the core substrate and including interlayer insulating layers and conductor layers, and a back build-up layer formed on back surface of the core substrate and including interlayer insulating layers and conductor layers. The conductor layers in the front build-up layer include a conductor layer sandwiching one of the interlayer insulating layers with the front conductor layer such that the conductor layer and the front conductor layer have the same electric potential in region surrounding the cavity.

A battery embedded structure is disclosed. The battery embedded structure comprises a substrate including one or more stacked battery units. Each stacked battery unit includes two or more conductive layers and one or more unit cells. Each unit cell is disposed between two conductive layers. The substrate has a principal surface provided by one or more respective side surfaces of the one or more stacked battery units. The battery embedded structure also comprises a wiring layer disposed on the principal surface of the substrate. The wiring layer includes a plurality of electrical paths and a plurality of vias. Each via is connected with one electrical path. Each via is located at a position corresponding to an edge surface of a conductive layer of the two or more conductive layers of the one or more stacked battery units so as to contact electrically to that conductive layer.

This electronic device is provided with: a resin molding; and a conductive cable including an electric wire. One end portion of the conductive cable is embedded in the resin molding. The surface of the resin molding exposes an end surface on the side of the one end portion of the conductive cable and includes a surface which is continuous to the end surface. The electronic device is further provided with wirings formed on the end surface and the surface so as to be connected to the electric wire in the end surface.

In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.