A method for producing a piezoelectric stack actuator and a piezoelectric stack actuator are disclosed. To increase service life of a piezoelectric stack actuator made up of individual actuators, includes providing at least two actuators the method and designed and configured to generate a deflection along an axis (A) when electrically activated; and coupling the at least two actuators to form the stack actuator such that deflections of the actuators generated when the actuators are electrically activated are overlaid along a stacking axis (S) and there is a force-coupling of the actuators over at least one coupling area (K) that is smaller than a projection area (P) of the actuator onto a plane (E) perpendicular to the stacking axis.

A Microelectromechanical System (MEMS) device which includes a piezoelectric stack on a substrate separated by a dielectric layer is disclosed. The piezoelectric stack includes first and second piezoelectric layers with a first electrode below the first piezoelectric layer and a contact pad and a second electrode between the first and second piezoelectric layers. A first contact extends through the piezoelectric layers and contact pad to the first electrode and a second contact extends through the second piezoelectric layer to the second electrode. The contact pad prevents an interface to form between the first and second piezoelectric layers in the contact opening, thus preventing corrosion of the piezoelectric layers during contact formation process.

A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.

A design structure for an integrated radio frequency (RF) filter on a backside of a semiconductor substrate includes: a device on a first side of a substrate; a radio frequency (RF) filter on a backside of the substrate; and at least one substrate conductor extending from the front side of the substrate to the backside of the substrate and electrically coupling the RF filter to the device.

A conductive terminal structure for a piezoelectric device used as part of a tire mountable apparatus is provided. Unlike known electrical connection structures which include a plurality of conductive terminals that are all exposed through a single insulating layer of the piezoelectric device, such as a top layer of the piezoelectric device, the electrical connection structure can be arranged in a one up, one down configuration. In this configuration, at least one conductive terminal is exposed through a top insulating layer of the piezoelectric device. In addition, at least one conductive terminal of a piezoelectric component is exposed through a bottom insulating layer of the piezoelectric device. The electrical connection structure can be used in combination with a connector assembly design to preserve the integrity of the electrical connection between the electrical and mechanical connection structure and a printed circuit board.

An electroactive device may include (1) an electroactive polymer element having a first surface and a second surface opposing the first surface, (2) a primary electrode abutting the first surface, and (3) a secondary electrode abutting the second surface. The electroactive polymer element may be transformed from an initial state to a deformed state and may achieve substantially uniform strain by the application of an electrostatic field produced by a potential difference between the electrodes. Various other devices, systems, and methods are also disclosed.

An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.

A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer thereby reducing or eliminating bending of the assembly as installed in an environment, thereby increasing the effective stroke length of the assembly. Poling only a single layer would induce stresses into the device; hence, polling both piezoelectric layers even though only one layer will be active in use reduces stresses in the device and therefore increases reliability.

A multilayer piezoelectric element includes a ceramic base body, a pair of external electrodes, multiple internal electrodes, and surface electrodes. The pair of external electrodes cover a pair of end faces and extend from the pair of end faces along a pair of principal faces and a pair of side faces. The multiple internal electrodes are stacked inside the ceramic base body along the thickness direction, and are connected alternately to one or the other of the pair of external electrodes along the thickness direction. The surface electrodes extend from the pair of external electrodes along the pair of principal faces, and are each divided in the longitudinal direction at a position near, of the pair of external electrodes, the external electrode to which the internal electrode adjacent to the principal face is connected.

Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.